Electronics Forum | Tue Jun 04 17:05:52 EDT 2002 | davef
Solder balls floating around on the air currents of a reflow oven. I sincerely doubt it. Could the solder on your gold fingers be from: * Excess placement force during P&P? * Ejactula from solder deposits during rapid preheat ramp rates? * Ejactula
Electronics Forum | Thu Jun 29 06:26:36 EDT 2006 | AR
Hi Slaine, The terminations are still present on the component but all the solder (including the pad finish) has coalesced on to the terminations. The termination that normally is shiny and bright in colour has turned matte grey on that zone where t
Electronics Forum | Tue Dec 11 11:59:00 EST 2012 | sarason
The issue is surface tension around the connector. Your tip needs to have more surface tension than the pins of the connector as it forms a cluster when being soldered. When I used to solder superfine connectors with a metcal iron it had a horses hoa
Electronics Forum | Thu Jan 18 21:52:24 EST 2001 | arul2000
>>>>Dave, The BGA substrate surface finish is NiAu, while the PCBA pad surface is HASL. The solder ball composition is SnPb 63/37 and the solder paste used on the PCBA is also the same but with 2% Silver.>>> Dave, sorry I don't have the picture with
Electronics Forum | Thu Feb 18 21:51:48 EST 1999 | Dave F
| What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same. | 3: I'm unaware of such documentation, but then again documen
Electronics Forum | Mon Jan 11 18:54:35 EST 1999 | Dean
| This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. | Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? | | Thanks! | I have seen this be
Electronics Forum | Wed Mar 13 20:40:02 EST 2002 | davef
Nice maCHEEN, mon. Please explain, �reliably dispensing�. What do you mean? How do measure? How are you sure? Etc. Just as points of reference: * What is the ratio of height to diameter of your dots? * How are you sure that you�re not stringing?
Electronics Forum | Wed Apr 06 22:59:02 EDT 2005 | smt_rookie
It is the solder ball that's usually encountered in a reflow process. It's just that, the paste did not wet well along the connector pins. Before reflow, the paste is actually at the tip of the connector, and stayed there and never went up to fill th
Electronics Forum | Sat Apr 23 13:54:09 EDT 2005 | Indy
I don't know wat are the types.. but wat I can tell you is you need care while profiling them. it needs a peak of around 215-220 if Sn/Pb.. at the ball. So the plastic on top will reach a higher temp. Care must be taken so that it doesn't roast. al
Electronics Forum | Wed Jun 26 13:15:18 EDT 2013 | hegemon
Thinking about it... If your sphere diameters were all the same, then your planarity should be established. Sounds like a job for an AOI type machine, with a laser height checker. I take it you have many of these to check, and are looking for someth
