Electronics Forum | Mon Nov 01 22:16:20 EST 1999 | chartrain
Your problem is common on this solder defect. It is sometimes known as squeeze balls. The formation of these result from excess volumes of paste applied to the pads. Once the paste melts and covers the pad and component termination,the excess has no
Electronics Forum | Thu Apr 03 09:08:50 EST 2003 | rdr
Thanks Scott,Iman, The problem has been isolated to detachment from package so I believe that there are no fabrication issues related to the Gold on the PCB. What is a Moyet analisys? where can I find more info? Dave, I am still waiting on Altera t
Electronics Forum | Wed Dec 23 11:11:07 EST 1998 | john watt
| | I have been developing a BGA Process and are having problems with a 310 IO PBGA reflowing. I am achieving good wetting exept 2 to 5 balls on the outer perimeter I have a good profile my air flow is set per mfg spec, the strange thing is that it d
Electronics Forum | Thu Feb 14 23:37:38 EST 2008 | operator
That is bizarre. I would have to say that you need to do a test on the PCB to test solderability with an iron like mentioned before. If you don't find that the pads are contaminated or masked over lightly and the pads do take solder effortlessly, you
Electronics Forum | Fri Nov 27 09:00:48 EST 1998 | Christopher Lampron
| Hi | I have been conducting my first reflow profiles. Most of the texts that I have read suggest soldering the thermocouples to a populated pcb. I am finding this very difficult. I have been using a high melting point (Sn5 / Pb95) solder and the
Electronics Forum | Tue May 22 17:24:12 EDT 2001 | davef
What is your thinking on the issues surrounding design and manufacture with leadless leadframe [eg, land grid array, micropak] components beyond those in http://www.national.com/ads-cgi/viewer.pl/an/AN/AN-1187.pdf? The curve ball that we just looked
Electronics Forum | Mon Jan 17 18:36:26 EST 2000 | William
Voids can be acceptable @ 24% per 5 balls area, and 8% per single ball area. In fact, Proceeding Book 1996; Vol. I, Page #126 conclusions saids: that solder joint voiding at the maximun levels pbserved in this study (were voided area was up to 24 per
Electronics Forum | Thu Aug 12 10:50:19 EDT 1999 | John Thorup
| Hello everyone, | | I would like to know more about the so called FACETED or "Mirror ball" surface apperance. Its cause and how to eliminate / corrective actions for it. | | pls. help... | | thanks and best regargs, | ...Omat | Omat While I hav
Electronics Forum | Thu Nov 06 07:54:50 EST 2003 | davef
First, skewing is a perfectly acceptable condition, providing the amount of skewing is not excessive. A-610 provides guidance. Second, this part is a land grid device. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA
Electronics Forum | Mon Apr 19 15:45:21 EDT 2010 | dwonch
Thanks to all for your input. We did have a third party do an analysis on boards from the first shop. They were shipped directly from the board shop to eliminate the possibility that we could contaminate them. The third party (Forsite) did find Sili
