Electronics Forum | Tue Jul 31 20:55:36 EDT 2001 | davef
Just so that you know, the 5DX does laminography. Like the word lamination, laminography takes a series of short focal length xrays, each a little deeper than the previous. Microlaminography allows layer by layer information to be measured in 'slic
Electronics Forum | Mon May 10 15:55:16 EDT 1999 | Paul Wieland
| Can anyone pls enlighten me on the rework of BGA. | I reworking on a optic BGA with a glass plate on it. | Is there any special requirement to take care for the | rework. | | Thank You **************** I don't fully understand you problem but
Electronics Forum | Fri Apr 16 19:02:39 EDT 1999 | Dave F
| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | Gerry: I imagine there could be s
Electronics Forum | Tue Feb 09 18:48:21 EST 1999 | Earl Moon
| Has anyone had any experience in using SMT to mount an organic (FR-4, Getek) rider card onto an organic (FR-4, Getek) mother board? By SMT I mean the attachment of the rider card would be through pads directly to pads on the mother board. | | Than
Electronics Forum | Mon Dec 21 17:50:55 EST 1998 | anamonus
| I have a mixed technology board ranging from 50 mil pitch devices to 20mil Qfp's to PBGA-352 at 1.27mm, and 6 Intel uBGA-48 at 30 mil pitch. With all these different package types i'm torn between using a 4 or 5mil thick stencil. The ball dia. is 1
Electronics Forum | Mon Jul 27 13:59:11 EDT 1998 | Robert Steltman
We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ============= 1) 16 layer (4 power, 4 gnd, 8 signal) 2) gold on nickel finish 3) ceramic BGA with eutectic balls Refl
Electronics Forum | Thu Feb 12 20:36:26 EST 1998 | Jon Medernach
| Using metal squeegees on GSPs has caused premature stencil wear. Has | anyone had any success with this combination? How much snap off did you | use? We are using .5 mm pitch and have a no clean process. Stencil wear is is minimal but exists. T
Electronics Forum | Thu Feb 27 12:23:47 EST 2003 | woodsmt
James, Have you considered going to a No-clean process? BGA's can be difficult to impossible to clean using an aqueous process. The water just won't penetrate under the entire BGA and efficiantly remove your flux residues. The tighter the pitch
Electronics Forum | Tue Apr 01 08:59:06 EST 2003 | rdr
Hi all, I've got a question that hopefully someone can provide insight. We have a gold immersion assembly that we believe is experiencing fractures or non wetting on a certain BGA. To be sure that it is a fracture and not a wetting issue I would li
Electronics Forum | Tue Apr 13 21:32:42 EDT 2004 | aqueous
Dreamy, OA fluxes / pastes have differing levels of activity. Most OA fluxes must be cleaned very soon after reflow. OA fluxes and pastes, while offering an aggressive flux package and a relatively easy removal (solubility in water), they are the
