Electronics Forum | Fri Mar 25 10:50:01 EDT 2011 | grahamcooper22
3 deg / sec) then the flux can slump from the paste and solder is carried with it off the pad and will form balls. Finally, are your pcbs dry ? Pass a bare one through the reflow oven before you print any paste on it, let it cool and then process as
Electronics Forum | Tue Aug 14 13:54:57 EDT 2018 | etmpalletguy
Vlad, Reduce your aperture opening in the stencil, this will give the stencil a good seal around the specific area of concern. In a wave solder environment, solder balling top or bottom surfaces in a wave pallet is caused by excessive flux burning o
Electronics Forum | Mon Aug 29 11:05:10 EDT 2005 | foresiteeric
davef: I am a colleague of Sara at Foresite and we came to the conclusion that the solder balls were entrapped based on the minimal amount of information from the original question and the fact that the x-ray showed the balls and it wasn't mentioned
Electronics Forum | Tue Dec 22 10:59:20 EST 1998 | John Watt
Folk's, I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, texture, com
Electronics Forum | Wed Nov 14 12:11:04 EST 2001 | eabbott
We are experiencing many solder balls after wavesolder. Two different board suppliers of the same board are involved. My initial reaction was that it was the process but in researching information in this forum I am beginning to wonder. How can on
Electronics Forum | Tue Nov 27 12:12:53 EST 2001 | Justin
We have noticed that when you are using a no-clean flux with the wave solder process that you will have additional solderballs. One thing that we have done is to change the PCB finish to a matte finish. This has greatly reduced the number of solder
Electronics Forum | Fri Jul 27 13:51:53 EDT 2018 | vlad_saviuk
Hi, have some question: during solder paste printing I'm faced with problems on the edge of the PCB - solder balls on gold pads. During analisys we checked everything - change squeegee preasure, different cleaning cycles, squeegee speed - no effect.
Electronics Forum | Sun Aug 28 09:23:52 EDT 2005 | davef
Sara Rice: How did you determine the balls were entrapped?
Electronics Forum | Thu Sep 01 09:05:47 EDT 2005 | russ
Thermal pads located underneath leadless devices require a 50% reduction in the stencil aperture.
Electronics Forum | Thu Sep 01 11:25:21 EDT 2005 | chunks
Unless it is peppered with via holes. Then it depends on the size of the pad and via holes.
