Electronics Forum | Mon Aug 11 10:48:06 EDT 2008 | realchunks
Too much flux will spatter and can leave balls on either side. From your pix you may too little flux. Try turning up and see. Also try hand applying your alcohol based flux and running through. Will take away a few question marks.
Electronics Forum | Wed May 03 02:26:10 EDT 2017 | Rob
Hi Phil, we were given a ball park of approx $125K for a non inline version for one of our applications. Can't find the inline quote.
Electronics Forum | Thu Jun 08 09:54:07 EDT 2006 | slthomas
Awwww, man. I was looking for something a little less on the anecdotal side for our local municipality's environmental stewards.
Electronics Forum | Tue Mar 06 14:10:52 EST 2001 | CAL
Are the voids in the balls of a BGA? Are you verifying this through x-ray if they are? some voids depending on size and location are some what accepted. Solder paste type? Solder paste date code? Humidity high? PCB's been stored in a truck trailer?
Electronics Forum | Thu Dec 09 07:46:42 EST 2004 | davef
We did this for BGA pads, but have not thought about other types. So, this may or may not apply for those. Pad defined by:||Advantages||Disadvantages Non-solder mask||No point-of-stress concentration at edge mask and solder ball||Smaller pads have
Electronics Forum | Mon Aug 04 12:29:12 EDT 2008 | realchunks
If you are getting top side wetting, I doubt if this is a Delta-T problem. It also could be there is a lot of flux on the top side of the board stuck between the connector and the board. This is easily checked by fluxing and not running th eZ axi
Electronics Forum | Tue Jan 15 06:05:37 EST 2002 | Romain
Dear all We have since few weeks problems with BGA solder joint integrity on ENIG finish. Under relatively very flexible of the FR4, the joint breaks between ball and PWB. When we take off the BGA for analysis, some of the pads seem very flat, totaly
Electronics Forum | Thu Jun 01 16:30:05 EDT 2006 | slthomas
Just wondering if anyone knows this off the top of there head. I might be able to figure out the math based on surface tension (this is 63/37 so the data is out there) but I REALLY do not want to put that kind of effort into this. :/ Editing to clar
Electronics Forum | Tue Jun 06 15:45:18 EDT 2006 | slthomas
Yep. What I'm really looking for is the minimum radius of curvature for 63/37, which is a function of it's surface tension. It's physical properties issue, not an agency issue. I've seen some references that I have interpreted to mean that it's some
Electronics Forum | Mon Aug 16 05:42:53 EDT 1999 | Omat Marasigan
Hello reflow experts, I just wanted to know the effects of N2 and O2 on reflow furnace to the solder ball apperances. thanks in advance.... ...Omat
