Electronics Forum | Wed Jun 21 11:30:27 EDT 2017 | ranap121212
but we do not have laminate preheating on robots. There is no flux separate application, the flux is in the soldering wire
Electronics Forum | Thu Jun 22 09:50:48 EDT 2017 | capse
Are you using nitrogen in your soldering process?
Electronics Forum | Mon Dec 11 15:12:20 EST 2000 | accuspec
we are using alphametals no clean 95sn/5ag CL775 paste. After reflow there are solder balls on the board. mainly are around the cap. We are using a conceptronic concept 60 air. There are 4 zones with 8 chambers. We are not sure what the profile
Electronics Forum | Wed Jun 21 19:01:48 EDT 2017 | mac5
Try baking the boards; you may have a moisture problem.
Electronics Forum | Sat Jun 24 07:49:58 EDT 2017 | ranap121212
@Capse, No but the machine has such a construction, I can not this change
Electronics Forum | Fri Jun 28 04:10:24 EDT 2002 | robbied
Great, now at least I have an explanation of sorts. Thanks, Dave.
Electronics Forum | Tue Sep 14 16:23:54 EDT 2004 | dan
What is your cure time for the mask?
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is
Electronics Forum | Tue Jun 20 15:08:30 EDT 2017 | ranap121212
Hello I have the problem with selective soldering on the robot. Thin balls appear on the laminate. The tin sometimes shoots...? and then the balls are a few millimeters from the soldering point. I tried up or down with temperature, but it did not wor