Electronics Forum | Wed Jul 28 22:06:17 EDT 1999 | Dave F
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
Electronics Forum | Thu Jul 15 09:34:24 EDT 1999 | John Sims
I'm looking into vision inspection equipment to automatically inspect SMD placement and solder joint quality. Does anyone have any recommendations or know of any commonly used equipment? Do other manufacturers use vision systems at their inspection
Electronics Forum | Sun Oct 11 13:53:26 EDT 1998 | Vincenzo Longobardo
I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. Is there a technical d
Electronics Forum | Thu Jun 11 22:03:56 EDT 1998 | Dew Lolly
We own a BTU Convection Oven. Nitrogen helps make shiny joints since it reduces oxidation during reflow. It has helped us solder marginal solderably boards but otherwise if "pretty" and "shiny" is a requirement I would consider it. It doesn't turn
Electronics Forum | Tue Nov 27 15:57:58 EST 2001 | mparker
rather than applying jumpers, try thinking it another way. Have all possible jumper connections pre-made by the fab design. Use an exacto or dremel to "open" the undesired paths by removing a bit of copper trace. total flexibility, only one fab make
Electronics Forum | Fri Dec 07 11:46:28 EST 2001 | Brian W
Before changing solder pastes or jumping through too many hoops, check the melting point of the 100 Sn (pure tin) connection. According to Kester, the melting point of 100Sn solder paste is 232 degrees C. If you do not reach that temperature, you wi
Electronics Forum | Thu Jun 06 13:17:33 EDT 2002 | Hussman69
Don't forget squeegee type and angle. (Am I an Ian wanna be or what?) I'd leave out different types of solder paste. For measurement, use something like a Cyber Centry. It may cost a little, but if you're serious, it's worth it. Other wise you m
Electronics Forum | Tue Aug 20 11:24:46 EDT 2002 | yngwie
Experts, Is there any reference to the best wetting time when doing manual soldering in order to get the most reliable joints i.e to avoid thick intermetallic line formations. I heard people says, the shorter the better, but how short is short...sa
Electronics Forum | Tue Oct 15 10:46:47 EDT 2002 | Dan Davis
I have a supplier that utilizes a soft beam solder process for through hole components. We are experiencing bridging and cold joints on components with narrow pitch between pins. They are dragging the solder over these pins as well. I have asked f
Electronics Forum | Wed Nov 06 16:05:03 EST 2002 | cvrgirl
Hi Victor, I made many micro-sections for analysis, and I have seen porous, dense, and grainy solder joints. The condition has to do with the constituents within the solder and its reflow temperature. I can search your subject on IEEE and email you
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