Electronics Forum: solder joint separation (Page 176 of 317)

Butt-joints

Electronics Forum | Wed Sep 13 14:55:58 EDT 2000 | Mark S

Hi All -- I have read the IPC acceptability requirements of butt-joints, but haven't seen anything on how they're actually performed. I'm assuming we can trim a DIP package, and place the part onto paste immediately before relow (or hand-solder it l

Solder Paste Volume

Electronics Forum | Thu Mar 29 15:26:35 EST 2001 | johnw

measuring Paste volume or at least paste height is an essencial part of any SMT process. You've got to control those input's.... Paste volume determines how much solder is available for your joint so theres a direct to joint reliability / PCB reliabi

Re: ORBOTECH vs. VISCOM

Electronics Forum | Wed Nov 17 15:05:29 EST 1999 | Wade

I have had an Orbotech VT-8000 running in-line for almost a year and have been very pleased. The VT-8000 does everything the application engineers say it can do. The support and honesty provided by the Orbotech staff is outstanding. I talked to Vi

Re: Wafer Reflow Profile

Electronics Forum | Tue Feb 02 09:51:38 EST 1999 | Justin Medernach

| Hello Everybody: | | I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. | | We are witnessing dull solder j

Re: BGA quality standards

Electronics Forum | Thu Dec 17 17:34:26 EST 1998 | Earl Moon

| Has any anyone established / published quality standards for BGA solder joints? Is IPC-A-610 in process of adding standards for BGAs? | The debate continues. I have felt for some time a maximum 20% voiding is allowable under certain conditions (w

Re: Treading on dangerous ground

Electronics Forum | Thu Jul 23 13:11:13 EDT 1998 | Gestapo Allen

I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the rew

Why does everyone want to x-ray BGA?

Electronics Forum | Thu Apr 16 21:33:25 EDT 1998 | Steve Gregory

Hello Ya'll, I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? I know what most people will tell me; "Steve, that's a pretty silly question

Re: Why does everyone want to x-ray BGA?

Electronics Forum | Mon Apr 20 13:52:19 EDT 1998 | G.Wenker

| Hello Ya'll, | I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? | I know what most people will tell me; "Steve, that's a pretty silly qu

Why does everyone want to x-ray BGA?

Electronics Forum | Thu Apr 16 21:30:59 EDT 1998 | Steve Gregory

Hello Ya'll, I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? I know what most people will tell me; "Steve, that's a pretty silly question

Double sided reflow

Electronics Forum | Fri Feb 13 03:53:40 EST 1998 | Brian S. Bentzen

Hi , I have not been able to find any good description on how to perform double sided reflow on PCBs.The best would of course be to avoid reflowing the bottom side again but in real life this is not possible. So when double sided reflow soldering


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