Electronics Forum | Fri Feb 24 12:34:13 EST 2006 | Ticky Ticky Tembo No Sarimbo Hari Kari Bushkie Perry Pem Do Hai
Stepped stencils are usually the result of some dumb customer's requirement. 2 examples I can give: 1.) Customer demanded 50% wick-up the termination of a MELF component. No way you can get that from reflow. Played around with a drastic "step up
Electronics Forum | Fri Apr 14 07:59:42 EDT 2006 | amol_kane
Hi russ, I am in the process of developing a "hybrid" reflow profile to solder a board that has LF BGAs and leaded solder. Have you encountered a similar situation before? if so what was the "safe" top side temp for the leaded components that was set
Electronics Forum | Thu Oct 05 11:59:51 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon all! Theoretically, there should not be any issues soldering to the SN100C as the tin content of the molten paste alloy should wet to the finish with no problem. I would just ensure that the peak temperature of the joint is above the
Electronics Forum | Tue Nov 14 01:24:07 EST 2006 | CHITRA
In some of SMT PCBs, we get black coloured dull finish /soldering joints on leads for QFP. What is the reason for getting this black colour finish . If we use the same IC on some other board for the same pitch location ,we get good soldering result.
Electronics Forum | Wed Feb 07 17:05:48 EST 2007 | dsoohoo
Thanks Russ and Dave. Russ- I was planning on thoroughly cleaning out the remainder of the low temp solder and going back to 63/37 for re-installation of a new device (our company does not ever re-use a device). Given these circumstances, would you
Electronics Forum | Fri Jun 01 17:31:17 EDT 2007 | gsala
Thanks Patrick, also IPC-HDBK-001 explains even better then IPC-J-STD-004, but unfortunately not yet infos about flux for L-F soldering.That's why I am trying to get some infos more from experienced people. Some L-F (SAC or SACX) cored wires vendor
Electronics Forum | Wed Oct 31 09:09:35 EDT 2007 | russ
Small waves are fine, biggest problem is the little to no preheat length. This is reason that complex boards cannot be soldered without defects. They also do not handle thick PCBas very well either because of same issue. Most of these "benchtops"
Electronics Forum | Tue Nov 27 14:56:33 EST 2007 | jaimebc
Shy, What is your current method of applying adhesive? If the terminals of the component that has adhesive are not wetting ( or not forming a solder joint I think we are talking about ) after reflow, then you must be applying too much adhesive. As
Electronics Forum | Thu Oct 02 05:07:59 EDT 2008 | arebom
If you have coplanarity issues on components that have not been assembled yet, check out an equipment that will help you resolve the lead coplanarity problem before you load them in your assembly equipment; I know that Fancort sells an equipment for
Electronics Forum | Fri Oct 03 16:51:06 EDT 2008 | waveroom
If this is a one time rework might I suggest farming it out? 100pin QFP can be taken off no problemo.. Putting it back down properly and then hand soldering??? I wouldn't want that job. You need excellent placement and imaging and your not going to
