Electronics Forum | Thu Jan 24 16:17:31 EST 2002 | mzaboogie
I have recently been asked to look into some problems that we are having at wave. It is common for us to have unsoldered joints for boards that have SMT parts epoxied to the bottom side. Recently we have had a problem with a gold plated board. The wa
Electronics Forum | Tue Jul 30 08:37:39 EDT 2002 | davef
When you talk about 'poor wetting', 'dewett', 'no wets', etc.; are you seeing solder pulling back or away from the pad? Please describe the condition. Dewetting. The condition in the solder joint in which the liquid solder has not adhered intimate
Electronics Forum | Fri Jun 25 17:33:17 EDT 2004 | davef
Nonductile fracture!!! Sounds peculiar. In that case, stop wasting you time messing with the thermal recipe. Either your: * Components have poor solderability [test this by dipping the leads of a couple of the SSOP in your solder pot and then asse
Electronics Forum | Mon Jan 29 10:11:12 EST 2007 | muse95
What does your customer want you to do? I would not want a CM soldering one of my boards with leadfree paste if I didn't ask him to. Whatever you do, get approval first. Two things to consider: If the other components are not rated for leadfree tem
Electronics Forum | Wed Apr 11 16:09:16 EDT 2007 | egrice
Robot soldering has never really worked well and if you are looking for any volume or repeatability, you may be disappointed! Even though you are using a robot, you are still soldering with an iron and wire solder. This process cant guaranty the be
Electronics Forum | Sat Oct 27 12:52:58 EDT 2007 | gregcr
We do very little wave soldering, maybe once a week. We have been running a Novastar Spartan 8S for years with very good results. I do wish we had the wider 12S for the wider boards, but it has only come up once in 7 years. I think there is a lot
Electronics Forum | Sun Dec 11 22:55:22 EST 2016 | ppcbs
What type of flux is in your solder paste? Active or No-Clean? With lead free solder you really should be using an active flux. The lead free oxidizes during reflow if you are not using a Nitrogen or Vapor Phase reflow. So a more robust and activ
Electronics Forum | Thu Sep 26 14:45:36 EDT 2019 | dwl
Excellent X-ray picture, very helpful! It looks like you have a lot of voiding on the center thermal pad. My guess is that outgassing is pushing solder off the pad which is forming solder balls outside the body of the component package. The first
Electronics Forum | Sat Jul 24 00:04:55 EDT 1999 | Scott McKee
| | | There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not perform
Electronics Forum | Thu Feb 10 22:31:11 EST 2000 | Dave F
CK: If you�ve done everything under the sun process-wise at the wave: different fluxes, more heat, less heat, more contact time, and less contact time; and are running out of ideas; let me table some thoughts. � "Don�t mess with Mother Nature."
