Electronics Forum: solder joint separation (Page 221 of 317)

QFN soldering

Electronics Forum | Mon Nov 12 09:22:41 EST 2007 | devajj

BTW, The surrounded QFN fine pitch terminals > should have the normal aperture reduction of 7 % > in case of RoHS Senju solder paste. This works > for our Telecom customer. > > The vias in the > ground pad will be somewhat filled with solder >

Epoxy on bottom of SMT component

Electronics Forum | Thu Nov 29 15:08:56 EST 2007 | jaimebc

Shy, You mentioned that you are using "dog bone" apertures for your chip components? It doesn't make sense to me. I thought that the "dog bone" was used for fine pitch devices, to keep the solder away from the center and avoid bridging. It doesn't

OT: Wavesolder Process Engineer Needed

Electronics Forum | Wed Jul 02 16:13:19 EDT 2008 | ck_the_flip

Wow, I should apply! As others state, wave solder engineers are a dying breed - believe me, I've been doing it for over 15 years. Often times, a very THANKLESS job. People who've never "dealt" with wave think that it's "easy"...c'mon a board trave

BGA soldering problems

Electronics Forum | Mon Nov 24 11:19:21 EST 2008 | sjones

I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen

BGA soldering Problem

Electronics Forum | Mon Nov 24 11:26:08 EST 2008 | sjones

I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen

Latent shorts on QFN package

Electronics Forum | Wed Mar 04 08:21:42 EST 2009 | rgduval

It seems familiar, but nothing that I've actually experienced. I've read some articles about tin-whiskering in lead-free solder. I think NASA has some pretty good analysis (or, at least they did a couple of years ago). The summary is that without

PCB bows after wave soldering

Electronics Forum | Fri Jun 18 17:36:10 EDT 2010 | sid

Good afternoon all, I have been trying to find a solution to a defect I just noticed. After stencil printing and smt part placement on the secondary side of my boards, I run them through a wave soldering system. All my components got soldered perfe

ENIG Solderability Issues

Electronics Forum | Thu Sep 30 16:28:51 EDT 2010 | 18424

Hello All, looking for some help from you guru's. I have several Enig boards with solderability problems. Components ranging from 0402's to ssop's. Using AIM W/S leaded solder paste, profile is beautiful and has been for years running the same produc

Temporary SMT Jumpers

Electronics Forum | Tue Jan 03 17:38:38 EST 2012 | davef

Here's two ideas fro the fine SMTnet Archives: * On the bare board, during design / layout, the basic shape of the jumper is a 125 thou disc of copper [that of course is eventually covered with whatever solderability preservative we use on the board]

01005 components and reflow profiles

Electronics Forum | Mon Apr 09 19:50:33 EDT 2012 | action_101

Hello, We're building some boards with 01005's and the only issue we are running into is the solder is not reflowing. It's the damnest thing, we are having no issues with the printing process or placing the components, the two areas we thought we wo


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