Electronics Forum | Tue Oct 07 09:40:44 EDT 2008 | john_smith
Dear, Flexkhushi Do you mean 2 mm thick board or .2 mm board. If you are talking .2mm then you are refering to a flex circuit correct? What equipment will you be using to place the 01005 component? I
Electronics Forum | Wed Jan 21 04:14:19 EST 2009 | sachu_70
Hi Adam, I would suggest you refer IPC-2221 guidelines which define plating thickness as: Nickel 2.5-5.0 um , Gold 0.08-0.23 um. Although ENIG is a standard process, there is an associated risk towards Gold embrittlement, Porous Gold, or Black pad de
Electronics Forum | Tue Apr 07 13:17:10 EDT 2009 | tserra
I would recommend looking at SAKI/MacroScience. http://www.xraytechnology.eu/index.php?option=com_content&task=view&id=34&Itemid=42 I have seen the images created by MSX3000 from MacroScience which is now under SAKI and can tell you with certainty
Electronics Forum | Tue Jun 02 18:38:13 EDT 2009 | joeherz
Nicoleta, We're a CM and have produced many millions of solder joints with ENIG boards with no failure attributed to this surface finish. This represents several boards houses. Another poster is correct that any supplier you choose should have a c
Electronics Forum | Wed Feb 10 01:53:04 EST 2010 | sparrow
Hello Glenn, thanks a lot for your response. The company I work for is launching LEDs production this year. We'll need to do a number of the environmental tests in our quality control laboratory. So the application for SAM and Xray systems is inspect
Electronics Forum | Thu Mar 11 03:03:26 EST 2010 | grahamcooper22
Hi , Looking at your photo....can I also see a hole in the middle of the joint on the chip component ? Maybe its not just a problem with th ejoint son diodes ? Did you also get mid chip solder balls on chips? If so, I'd almost guarantee the pcb has t
Electronics Forum | Mon Aug 02 08:11:25 EDT 2010 | muarty
Is there a specification in relation to the proximity to features that a Flex circuit should or should not be bent? I am experiencing broken tracks on some flexible circuits which appear to be getting 'flexed' directly adjacent to a soldered joint in
Electronics Forum | Thu Aug 12 11:00:42 EDT 2010 | hegemon
Without seeing a picture, my first instinct would be first and foremost some fixturing that provides full support for your print process. After that, since you are citing bow and twist, consider that the fixturing might as well travel through the ov
Electronics Forum | Tue Oct 05 12:29:28 EDT 2010 | mikesewell
It is possible to infer that the lead is lifted based on the toe fillet appearance, but it's not as reliable as say a laser or xray inspection. This is usually done by varying the light source location and or color and looking at the images resultin
Electronics Forum | Thu Apr 14 09:39:41 EDT 2011 | blnorman
ROSE has the advantage in that it does have a specific acceptance criteria (J-STD-001), whereas the IC does not. ROSE allows the test to be run at ambient or at an elevated temp, IC requires the component/board/assembly to be "cooked" for 1 hour @ 8
