Electronics Forum | Mon Aug 28 12:44:23 EDT 2006 | actech
WE have been running a leaded product for a few years and while the product is exempt from PB free regulations the components have been comming in lead free reciently and this caused little or no change in the process and or product, However! the Boa
Electronics Forum | Fri Nov 10 17:00:05 EST 2006 | darby
Yep. If speed is not an issue a Heller 1500 will pretty well do you fine unless you are trying to process a brick. A Heller 1700 will not give you any more heated length, so don't get sucked in to that one. However, they are a little more fun to pl
Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack
Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal
Electronics Forum | Thu Mar 22 06:28:08 EDT 2007 | Hussman
Anyone ever design an external thermocouple that connected back to an enclosed PCB? If so, how did you make the interconnect or solder joint to the board? Did you change metals to a solder friendly material? The problem we have is an external t-
Electronics Forum | Mon Apr 02 10:20:40 EDT 2007 | realchunks
Hi Chris, Yes, my hand is up. But the problem is WHY you are stock piling printed boards. Is it a single printer used to feed various lines? I would think that since you are hand placing parts, that this printer would be able to keep up. Obvious
Electronics Forum | Fri Apr 20 18:21:55 EDT 2007 | Hegemon
Consider how the vast majority of PCBs with BGAs are produced. Forced air convection. Anything that comes closer to duplication of the original soldering profile is what you desire. Did they build it with IR or Convection? The process engineer wa
Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef
There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si
Electronics Forum | Fri Sep 28 16:49:48 EDT 2007 | davef
good * No IMC => bad Intermetallic growths are diffusion limited, and therefore the thickness of the intermetallic is given by: z^2 = (Do)(t)exp[-Q/RT] Where Do (m^2 s-1) is the diffusion coefficient, T(�K) is the temperature, Q (J mol-1) is the act
Electronics Forum | Wed Nov 21 09:19:09 EST 2007 | Paul M.
Need some opinions from you fine folks. We are building assemblies 90% SMT, 10% TH. Fine pitch and BGA devices, etc. The customer is complaining about cold solder joints (SMT) after about 1 year of use, scattered thru-out the assembly, not consistan
Electronics Forum | Tue Apr 22 03:46:19 EDT 2008 | fowlerchang
It is CSP reliability issue, which is the mobile CPU from Spreadtrum. All the tests passed and shipped to customer. They assembly them and tested but failed. After they reflow this CSP with hot air gun, some of the boards passed. We got some board