Electronics Forum | Tue Jun 16 15:01:58 EDT 1998 | Gary Simbulan
There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior
Electronics Forum | Tue Jun 16 15:00:12 EDT 1998 | Gary Simbulan
There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. | Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior
Electronics Forum | Mon Jun 08 15:29:17 EDT 1998 | Gary Simbulan
| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil
Electronics Forum | Thu Oct 08 03:27:00 EDT 1998 | Thomas Blesinger
| | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema
Electronics Forum | Thu Oct 08 22:32:58 EDT 1998 | Dave F
| | | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the re
Electronics Forum | Thu Jun 04 11:23:25 EDT 1998 | Justin Medernach
| What methods do people use to dress pads after removing and before replacing the BGA? | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | Dave F Dave, Her
Electronics Forum | Sat Jun 06 07:04:27 EDT 1998 | Dave F
| | What methods do people use to dress pads after removing and before replacing the BGA? | | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | | Dave F | D
Electronics Forum | Thu Jun 04 22:36:23 EDT 1998 | Dave F
| | What methods do people use to dress pads after removing and before replacing the BGA? | | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | | Dave F | D
Electronics Forum | Wed Jun 03 18:22:19 EDT 1998 | Chrys
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
Electronics Forum | Wed Jun 03 21:40:38 EDT 1998 | Dave F
| | Hello: | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints
