Electronics Forum: solder joint separation (Page 271 of 317)

Solder Ball After Reflow Process

Electronics Forum | Sat Aug 19 14:12:13 EDT 2006 | Wave Master Larry

LISTEN I'll have to disagree Steve.i think this Chunks person oversimplifies stuff and I dont like her style I'm surprised because most orientals do better with analyzing stuff.reminds me of some engineers at my place of employment.Again Im fighting

AOI

Electronics Forum | Thu Sep 07 07:38:14 EDT 2006 | travis1977

I have experience programming and using the yestech system in a high volume high mix environment. The system seemed to work well until I used a more sophisticated system. When I changed jobs and had another opportunity to spec. in paste and post-r

Fibers In Solder Joints

Electronics Forum | Wed Sep 06 11:34:15 EDT 2006 | slthomas

I don't remember ever having that problem with my EKRAs, but you might look at how much fluid you're dispensing on to the cleaning medium if this is occurring while you're using wet cleaning cycles. It could be getting saturated to the point of weakn

Pasting ahead

Electronics Forum | Sat Nov 04 07:46:36 EST 2006 | itwasbill

Hi all, What are the pro's and cons of pasting ahead? The definition of pasting ahead for this question is the act of pasting 10 or 15 pc boards and then running then repeat. I do not like this philosophy. I'd prefer to paste, run, reflow then

DPMO as a metic to qualify a CEM as World Class

Electronics Forum | Wed Jan 17 18:08:51 EST 2007 | John S.

We use a fairly simple system. IPC put out standards 7912A and 9261A to define opportunities. Basicly the "number of components" + "number of solder joints" = "number of opportunities." Some six sigma benchmarking studies indicated "Sigma Level" =

AOI: �SAKI, OMRON, MODUS,MIRTEC...?

Electronics Forum | Thu Jan 18 08:30:12 EST 2007 | CL,

Good Morning, We also are using Mirtec. We have a total of 5 machines now. 3 in SMT, 1 in RoHS and 1 in Through Hole. We have had incredible luck with these machines and their service is outstanding. I do not have any experiance with the other machi

SMT INSPECTION SYSTEM

Electronics Forum | Fri Mar 16 01:26:31 EDT 2007 | CHITRA K

Many thanks for your reply. We would like to clarify two things; 1. We have recently purchased a vision system with oblique viewing facility to rotate the camera with 40x magnification, which we find useful to inspect fine pitch components . 2. Wh

IEC 60601-1 Humidity Failures - No Clean Flux

Electronics Forum | Mon May 07 15:46:45 EDT 2007 | Hoss

IEC 60601-1 is a UL regulatory standard for Medical Electronic Equipment. We recently ran the humidity pre-conditioning segment of this testing and have found electromigration repeatably in areas with hand soldered joints (remaining NC flux). IEC 6

Epoxy on bottom of SMT component

Electronics Forum | Mon Dec 03 20:30:58 EST 2007 | shy

Q: I thought you said that the parts that weren't wetting in reflow were the parts with epoxy. A: Yes you're correct. Q: The question I have is do they wet in wave solder, and if they do, why does it matter what happens to them in ref

SMT Adhesive and Other

Electronics Forum | Thu Feb 07 14:58:08 EST 2008 | operator

We don't have one of those cool air compressed syringes to dispense adhesive. We have to do it by hand. My question is does anyone have any suggestions on syringe size, needle size etc... for successful deposition of SMT adhesive? I know you can go s


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