Electronics Forum: solder joint separation (Page 281 of 317)

Bottom side process question

Electronics Forum | Thu Mar 15 15:36:39 EST 2001 | traviss

Don�t be afraid of the more standard doubles sided mixed process. Even without a chip wave it works, don�t get me wrong it works better with the chip wave, but even without chances are you will be spending more on the additional steps than you would

0402's for the first time!

Electronics Forum | Wed Jul 25 23:35:18 EDT 2001 | mugen

my guys SOP : Round #1 1) take double-side tape, and peel it flat to the PCB. 2) process this PCB only through P&P SMT. 3) confirm the SMD placement Round #2 4) take thin plastic sheet and tape corners flat to the PCB. 5) solder paste print over t

0402's for the first time!

Electronics Forum | Wed Jul 25 23:37:11 EDT 2001 | mugen

my guys SOP : Round #1 1) take double-side tape, and peel it flat to the PCB. 2) process this PCB only through P&P SMT. 3) confirm the SMD placement Round #2 4) take thin plastic sheet and tape corners flat to the PCB. 5) solder paste print over t

Re: PTH connectors mounted on SMD process

Electronics Forum | Wed Dec 29 14:30:28 EST 1999 | Dan Woodward

I am not sure if I have seen an article comparing solder joint strength Vs pressfit although I am sure this has been researched by literally hundreds of companies before they felt comfortable going to pressfit. I know one of the issues with solder is

Re: Time to use alternative finishing ???

Electronics Forum | Mon Sep 13 05:02:19 EDT 1999 | Brian

| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Mon Apr 26 09:46:05 EDT 1999 | C.K.

Chrys: I have checked all the basic elements of Wave solder joint formation: fluxing, preheating, and lastly soldering. For checking the fluxer, i used a product from ECD that's very similar to what you desribed called the flux-o-meter. It did a

Re: Bench marking Wave Solder

Electronics Forum | Fri Apr 23 14:14:49 EDT 1999 | Chrys Shea

| Hi everybody, | | I would like to bench mark the quality out of our wave soldering m/c as far as DPPM levels are concerned. Can somebody provide me with some figures at their site or anywhere else for the same. | | Thanks | Upinder | ====== | We

Re: soldering to hard gold plated PCBs

Electronics Forum | Wed Feb 03 18:36:47 EST 1999 | Earl Moon

| Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connect

Re: Reliability of Reworked BGAs/CSPs

Electronics Forum | Wed Feb 03 18:32:07 EST 1999 | Earl Moon

| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa

Re: here's one for you board stuffers!!!

Electronics Forum | Tue Jan 12 10:18:36 EST 1999 | Russ Steiner

| Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality. But I'm trying for a general answer. On pre-tested assemblies, should you exp


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