Electronics Forum | Tue Mar 23 10:46:48 EDT 2010 | oeidave
Hello Sibbe, Thank you for posting your questions. There are a few approaches to AOI with the majority being program driven. There are a couple of systems that are simply comparative in that you use the system to compare a golden board to others th
Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh
Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr
Electronics Forum | Thu Jan 13 10:40:38 EST 2011 | tony_d
Good Day Michelle, If you are looking for a solid AOI system that is simple to program and extremely accurate my recommendation is MIRTEC by far. We checked out several machines and narrowed the selection down to two, YESTech and MIRTEC. We had an
Electronics Forum | Wed Jun 22 22:48:46 EDT 2011 | tony_d
Hello NHTech, When it came time to invest in AOI, my team and I checked out several machines. We run a wide variety of products and our changeover is high, on the order of five to ten jobs per day. MVP is one of the machines that we looked at, how
Electronics Forum | Fri May 24 19:18:03 EDT 2013 | hegemon
The formula is a great help, where was it 20 years ago? LOL After running a few thousand different products over the years, you start to get a feel for what is going to be trouble with regards to falling off the bottomside during the secondary refl
Electronics Forum | Tue Dec 24 09:34:55 EST 2013 | emeto
Hi, it is a not given clear here. I will tell you some basics about the profiling: 1. Profile stages A. Preheat - the board preheats from room temp to 130-150C depending on the paste B. Soak - 150-170(or other range depending on the paste). here th
Electronics Forum | Mon Aug 25 12:43:35 EDT 2014 | freddimock
Numerous people use the Pyramax oven to process high temp solder but your success will depend upon the mass of your board. To maximize the probability of success you should use the highest convection rate (IWC) possible to enhance heat transfer an
Electronics Forum | Wed Nov 19 15:48:48 EST 2014 | gregp
Thank You Adam...this is the type of input I am looking for. To summarize, you are an OEM that has gone through the process to remove most through hole parts from your assemblies. Those that remain are primarily connectors which may not require lea
Electronics Forum | Thu Jul 23 13:23:45 EDT 2020 | bmalhi
Small components blown issue could be due to one of the below. - Process issue; Make sure solder paste is fresh, if flux is drying out it will not hold parts properly. Check downward pressure of Pick Place. SOT may have to be pushed a little harder i
Electronics Forum | Sat Jan 16 02:43:21 EST 1999 | Earl Moon
| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have
