Electronics Forum: solder joint separation (Page 316 of 317)

Vapor phase versus forced convection

Electronics Forum | Mon Aug 16 20:19:10 EDT 2004 | Grant

Hi, We have both Vapor Phase ASSCON semi auto as well as Soltec convection inline ovens. I must say we had no end of problems with Vapor Phase. We tried everything, and just could not totally eliminate tomb-stoning completely. We would always get a

CP42 Camera Problem

Electronics Forum | Mon Mar 03 12:25:37 EST 2008 | daxman

The problem was first noticed while doing a nozzle center. The wide angle camera would not display an image. After rebooting the machine (sometimes it took several tries) the camera would work. A few months later, the wide camera would not boot at a

Re: Simutaneous Double sided reflow assy

Electronics Forum | Thu Jul 20 17:01:26 EDT 2000 | Bob Willis

Here is some further information on SDSRS process, but please purchase a copy of the report from t he SMTA as all the money goes to charity. In the UK the SMART Group raised over �3000 for the homeless. SMTA have been raising a lot of money for the G

Re: SDRSS

Electronics Forum | Thu Jul 20 15:08:53 EDT 2000 | Bob Willis

Yes no problem here it is in a nut shell. The sponsor of my CD ROM on this process was Loctite who specifically developed a glue for the process to cure in less than 10seconds. Have a word with these guys they may even have a few CDs. PROCESS SEQUEN

Re: Reflow profilers? worth it? - You BET!

Electronics Forum | Thu Aug 12 17:17:47 EDT 1999 | Brian Wycoff

| | | Does anyone use reflow profilers? Are they a good investement or is trial and error sufficient? | | | | | | Does anyone have any suggestions on profiles to try? Thanks. | | | | | Danielm | | I would hazard a guess that most if not all of us

Re: Component Packaging Trends

Electronics Forum | Fri Oct 16 16:11:52 EDT 1998 | Joe Belmonte

| | Hi Folks, | | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your proc

Problems with TI DSP modules

Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef

1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we

Warning not for pro RoHS people

Electronics Forum | Tue Sep 26 14:06:33 EDT 2006 | patrickbruneel

Jun 26, 2006 (See Comments Below) Editorial Managing the Naughty Child Mike Martel, Editor, Circuitnet I've been listening to voices on both sides of the RoHS issue and the more I hear, the more foreboding the tone becomes. Despite what some wr

A.O.I recommendation

Electronics Forum | Fri May 27 08:30:04 EDT 2005 | FFagundes

I think I have everyone beat. I work for a small Contract Manufacturer, and we are trying to grow our business. We generally have two or 3 different jobs running at the same time and up to 10 different jobs running in a day. So we needed to find a

Lead free in hirel

Electronics Forum | Mon Jan 25 13:42:35 EST 2010 | patrickbruneel

This is a post from another forum as a response from Bob Landman to a claim that he had no evidence to be concerned about lead-free in hirel applications (interesting read). See below and am sure many technetters will find this interesting **********


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