Electronics Forum | Thu Jun 06 13:17:33 EDT 2002 | Hussman69
Don't forget squeegee type and angle. (Am I an Ian wanna be or what?) I'd leave out different types of solder paste. For measurement, use something like a Cyber Centry. It may cost a little, but if you're serious, it's worth it. Other wise you m
Electronics Forum | Tue Jan 21 11:03:15 EST 2003 | MA/NY DDave
Hi You already received good answers. A thing to remember is the components and the PCB. How high you go above 63/37's 183C should be limited to create a good solder joint. Too long creates problems since the components and the PCB start to be he
Electronics Forum | Thu Feb 12 10:19:46 EST 2004 | Bryan
Hi all, These days our customer asks us to figure out ,during reflow,the BGA ball and solder paste,which will first melt? I think it's very hard to get the rusult.coz I think it'll vary at diffrent part of the BGA,and how can this affect the perf
Electronics Forum | Mon Jun 14 16:48:34 EDT 2004 | jsmith01
Is any one else having a problem with parts that are Ni/Sn plated? The parts in question are a 1206 voltage suppressor form AVX. I am still using a stander 63/37 solder paste which is according to AVX�s web sight compatible with this plating. The
Electronics Forum | Wed Aug 04 17:16:13 EDT 2004 | Richard
Can anyone comment on inspection criteria for PIH applications. I'm of the opinion that the inspection criteria used for wave soldered joints should be used for PIH. Some colleagues believe that a bottom side fillet is not necessary since the solde
Electronics Forum | Tue Aug 24 04:35:33 EDT 2004 | rlackey
Hi Mike, Thanks for the comments. We are upgrading our post reflow inspection - primarily solder joint inspection, and capable of keeping up with a maximum of 80K components an hour. Solder paste inspection is currently carried out by our prin
Electronics Forum | Thu Sep 02 18:39:48 EDT 2004 | steveg
We're having a lot of problems with failed solder joints to gold-plated MOSFET leads. Gold plate thickness spec is 60uin, but we've seen as much as 200uin in cross-section, so we're obviously concerned about gold embrittlement issues. Pre-tinning w
Electronics Forum | Wed Dec 07 00:43:13 EST 2005 | ajay
Hello All, Do any acceptable criteria is followed on DPM for SMD soldering joint / defect. We do face tough time with QA, as they demand 100%. Our SMD board is having about 2000 soldering point & even 99.90% ok (1998 points ok out of 2000) QA do not
Electronics Forum | Wed Feb 22 08:01:42 EST 2006 | INGE
We have a new SMT line, our customers are asking us the validation of the process. Not only the validation of the resulting assembled board (solder joint...) but also a validation of every single machine in the line (ex. stencil printer...). For exam
Electronics Forum | Wed Oct 04 11:36:06 EDT 2006 | flipit
Hi, Anyone ever have an issue with stray capacitance when using no clean solder paste. We are having a timing problem on one product. The problem goes away when we clean the assemblies. We use a no clean process normally. These assemblies worked
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