Electronics Forum | Mon May 11 13:59:53 EDT 1998 | Chris Fontaine
| Hello. | 1 Could anyone tell me the range of temperature | to solder MI components? The process eng is using 400~500 | degrees Celcius!! For standard 0805/0603 chips & TH components & | also to touch up on ICs. What is the con
Electronics Forum | Wed May 13 16:39:41 EDT 1998 | Herb Pabes
| | Hello. | | 1 Could anyone tell me the range of temperature | | to solder MI components? The process eng is using 400~500 | | degrees Celcius!! For standard 0805/0603 chips & TH components & | | also to touch up on ICs. What
Electronics Forum | Fri Jun 25 17:33:17 EDT 2004 | davef
Nonductile fracture!!! Sounds peculiar. In that case, stop wasting you time messing with the thermal recipe. Either your: * Components have poor solderability [test this by dipping the leads of a couple of the SSOP in your solder pot and then asse
Electronics Forum | Wed Apr 11 16:09:16 EDT 2007 | egrice
Robot soldering has never really worked well and if you are looking for any volume or repeatability, you may be disappointed! Even though you are using a robot, you are still soldering with an iron and wire solder. This process cant guaranty the be
Electronics Forum | Sat Oct 27 12:52:58 EDT 2007 | gregcr
We do very little wave soldering, maybe once a week. We have been running a Novastar Spartan 8S for years with very good results. I do wish we had the wider 12S for the wider boards, but it has only come up once in 7 years. I think there is a lot
Electronics Forum | Sun Dec 11 22:55:22 EST 2016 | ppcbs
What type of flux is in your solder paste? Active or No-Clean? With lead free solder you really should be using an active flux. The lead free oxidizes during reflow if you are not using a Nitrogen or Vapor Phase reflow. So a more robust and activ
Electronics Forum | Thu Sep 26 14:45:36 EDT 2019 | dwl
Excellent X-ray picture, very helpful! It looks like you have a lot of voiding on the center thermal pad. My guess is that outgassing is pushing solder off the pad which is forming solder balls outside the body of the component package. The first
Electronics Forum | Tue Aug 17 09:59:50 EDT 1999 | Earl Moon
I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the adve
Electronics Forum | Fri Aug 02 10:22:07 EDT 2019 | philc
Metcal? Really? I tried them, and found them to be lacking in ability for my needs. Soldering anything with a lot of copper resulted in the tip "sticking" to the PCB, and it was very slow to respond when in use. The JBC units might not be cheap, but
Electronics Forum | Tue Sep 07 06:17:31 EDT 1999 | Earl Moon
| | My company is starting a prototype. The chips that will be used appear to be very sensitive. The vendor part number is Neta-40-2. | | My question is what solder temp should be used for this part? | | Any advice is appreciated. | | THX. | | | |
