Electronics Forum | Wed Feb 25 17:02:05 EST 1998 | Doug Romm
Just a comment to clarify this discussion. Typically chip caps and other passive components that use palladium plated to the end of the component are very different from the TI nickel/palladium plated IC components (leaded devices). The main di
Electronics Forum | Thu Mar 29 15:26:35 EST 2001 | johnw
measuring Paste volume or at least paste height is an essencial part of any SMT process. You've got to control those input's.... Paste volume determines how much solder is available for your joint so theres a direct to joint reliability / PCB reliabi
Electronics Forum | Wed Jul 19 20:28:49 EDT 2006 | mrduckmann2000
We recently purchased a Mirtec AOI machine, it take a bit to program but overall we are pleased. The machine has a downward looking camera, we have had some issues with the machine not catching opens. When a IC has it's legs bent straight up off th
Electronics Forum | Wed Apr 28 11:47:34 EDT 1999 | Frank Boyko
| | We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. | | Lately, we have been having solderability problems with boards with this surface from some of our suppliers. | | | | We are considering trying boards with White Tin solderable
Electronics Forum | Thu Sep 19 11:02:17 EDT 2013 | hegemon
If there is only a single lead free BGA on the BOM, I would suggest a "hybrid" profile. Use regular solderpaste (SN63/pb37) and peak your temperature at around 225C. Allow a bit longer TAL to let the two solders co-mingle at the BGA joints. You are
Electronics Forum | Mon May 12 13:55:19 EDT 2014 | hegemon
It sounds like a bit too much solder on the PWB, caused by too large a pad for the lead it will contain. In that case solder reduction is the way to move forward. What are the options there? 1. New stencil or stencils - (not desirable) 2. Increas
Electronics Forum | Tue Dec 14 12:00:34 EST 1999 | Kris Wiederhold
We recently reduced our standard aperture reduction to aid in the reduction of solder on gold defects. Since this reduction in aperture size, we have been experiencing exposed copper at the end of the component pads. The heel and toe joints are per
Electronics Forum | Fri Jul 13 18:25:09 EDT 2007 | seankim10
It sounds like more has to do with plating. you may also check out the voiding issue especially if you have new FAB or the supplier. I had problems with a RF chip in QFN package due to insufficient grounding that voiding caused. This ground is often
Electronics Forum | Tue Mar 16 05:11:47 EST 1999 | Charles Stringer
| | AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuard
Electronics Forum | Fri Apr 11 16:07:08 EDT 2003 | daanterstegge
I'd say your profile is about right, assuming these are values that you measured in the balls of this BGA and not elsewhere on the board. If you want a more shiny joint than use a nitrogen oven or experiment with various solder pastes, but why the he
