Electronics Forum: solder joint (Page 76 of 295)

Lead free profile

Electronics Forum | Tue Feb 01 11:54:14 EST 2005 | TomA

Indy, I found the same findings as you. The claim is that the solder joint may actually look closer to a SnPb solder joint then the SAC alloys. I had commited to the SAC alloys at SMT before finding out about the SN100C alloy. I'm interested in what

SMT adhesive printing

Electronics Forum | Wed Dec 15 09:00:07 EST 2004 | russ

All of the SMT adhesives that I have used are non-conductive by themselves. I assume that the solder joints are formed by wave soldering?

Nano ProTek Coating

Electronics Forum | Thu Jul 21 07:21:47 EDT 2011 | ccouture

So far after ~1500 units printed with the stencil treated once with Rain-X, no issues were detected with solder joints. The only difference is no more solder bridges on fine pitch with .010" openings. The print is picture perfect on all pads, nice an

wire harness strength

Electronics Forum | Fri May 19 10:41:50 EDT 2017 | solderingpro

To be clear: Is the break occurring at the solder joint location? Also, can you advise what solder chemistry you are currently using?

Re: Noclean soldering to gold

Electronics Forum | Mon Dec 13 00:05:28 EST 1999 | Dennis O'Donnell

I can't figure out why everyone is plating everything with gold. According to the J Standard, gold plating should be removed before soldering to the surface. The gold, when left on the surface to be soldered will contaminate the solder joint and ca

Reflow soldering through hole parts

Electronics Forum | Mon Jan 29 16:12:05 EST 2001 | bill_scholl

I have been told that is is possible to reflow solder through hole components. Can anyone confirm this is being done reliably? If so, what are the required equipment, steps and processes? What is the reliability of the solder joints? Is this a genera

reworking brds by flowing the board thru' oven for the 3rd times

Electronics Forum | Mon Mar 19 11:26:21 EST 2001 | Steve

Another issue is that once solder paste has been reflowed, the majority of the flux is gone. If it is reflowed again without solder flux, the risk of introducing oxidation to the component leads is increased, thus creating a weak solder joint.

Solder Connection Environmental Screening

Electronics Forum | Wed Aug 23 09:05:38 EDT 2000 | Dave F

Dr. Lee: In using environmental screening tests to assess solder joint reliability, what are the effects that make low temperature vibration effective in screening of poorly wetted solder connections? What temperature and vibration profile are effe

Soldering norms for SMT I-leads

Electronics Forum | Tue Sep 15 06:05:58 EDT 1998 | Thomas Blesinger

Does a norm exist, that gives information on soldering of I-leads onto SMT-pads. Especially I am interested in statements about the quality of the solder joints

High temperature soldering

Electronics Forum | Fri Apr 24 14:34:14 EDT 1998 | Ed Holton

Looking for anyone who has experience with high temperature soldering. Need to determine why solder joints are failing. Thermocycling of unit is -40C to +140C, 30 minute dwell time, 10 sec. transition time Your help is appreciated Ed Holton Hella E


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