Electronics Forum | Wed Jul 02 07:00:56 EDT 2003 | davef
Title : SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Author : Fay Hua et al. Author Company : Intel Corporation Date : 01/01/2003 Source : Journal Of Surface Mount Technology, Volume 16-
Electronics Forum | Mon Dec 27 13:28:11 EST 1999 | Brian W.
Depending on the components you are seeing this on, one thing to check would be the solderability of the parts. Sometimes you will find the plating leeches away, and this is a component plating issue. When you solder, the plating actually leeches a
Electronics Forum | Tue Oct 22 17:23:35 EDT 2002 | Yannick
Hi, I wondering if someone know the anwser to that. I'm using a solder paste 63/37 and on the solder joint we have a tiny little layer or flux who is like crystalin. I try to play with my profile the get it off but I don't get much success. So D
Electronics Forum | Thu Oct 24 17:32:54 EDT 2002 | ksfacinelli
The big problem we saw was the appearance of the solder joint after the water wash process. We saw the joints turn white through the absorption of moisture. Looked real bad but still functioned. I would stick with using only one of the processes a
Electronics Forum | Thu Feb 19 19:08:02 EST 2015 | comatose
Ignoring the certification issue for a second, what is the alloy of those two joints? The melting temperature? The strength? And no. You added a single homogenous material (leaded wire solder) later in the process. Adding leaded solder makes it non
Electronics Forum | Sun Jan 24 19:53:54 EST 1999 | Steve Gregory
| It has been known that sufficient cooling after soldering is important in order to get a stronger joint during its solidification stage. And it has been so much emphasised with reflow oven. But, why many models of wave soldering machine do not come
Electronics Forum | Fri May 31 18:56:17 EDT 2013 | hegemon
Thanks to everyone for your answers... > > Delta T > represents the maximum temperature difference > between the hottest and coolest part of the > assembly.........so if we take a profile,the > hottest point would be on the solder pad and the >
Electronics Forum | Mon Nov 26 13:40:40 EST 2018 | robl
Hi Prem, Yes, the flux in the Cobar paste helped with wetting and joint strength, as does reducing voids as there is more solder in the joint, as does cooling rate. Regarding peel test in KG, it depends on the pad size and volume of solder in the j
Electronics Forum | Mon Apr 22 20:55:00 EDT 2002 | ianchan
Hi, this is not really a technical solution, just a feedback. we too have a model series using the same WS paste type. it gives a dull solder joint with white residue that can be marginally removed after post-DI water rinse (ie. not 100% removed).
Electronics Forum | Fri Dec 02 08:52:05 EST 2005 | pavel_murtishev
Good evening, I�ve just solved very similar soldering issue. In my case the problem was with 0603 chips. Solder joint had same appearance. I suspected that solder do not melted and increased TAL and peak temperature. No result. Next thing I tried to
