Electronics Forum | Thu Jul 29 15:29:30 EDT 1999 | Earl Moon
| | | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | | 12BGA per assembly | | | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | | Pads .014inch | | | | | | | Vias within footprint .02
Electronics Forum | Wed Oct 09 08:51:34 EDT 2002 | pjc
No, wouldn't want to, wouldn't be prudent. Best process I think is to solderpaste reflow the TSOP components then mask them for the wave. Mask using liquid type soldermask or a selective solder pallet. Or, if you must, the only way I can see any dece
Electronics Forum | Mon Dec 20 18:09:56 EST 2004 | BWET
Has anybody tried to use the new STENCILQUIK(TM) peel and stick BGA stencils that blocks solder flow and repairs damaged dogbone mask?
Electronics Forum | Wed Mar 03 17:09:55 EST 1999 | Tom Reilly
We have recently had problems with bare boards coming in too thick. I would like to know how to properly specify the minimum and maximum thickness using the 13949F and IPC 4101 specs. (We currently use "MATERIAL: GFN 0620 C1/C1 A2A per MIL - P - 1394
Electronics Forum | Fri Mar 24 18:07:25 EST 2006 | Chris
Flash gold is just thin gold plating over electroless nickel or electrolytic nickel. Flash gold is electrolytic gold where the panel is connected to a plating rectifier and current causes the plating process to occur. Gold thickness is controlled b
Electronics Forum | Thu Jun 24 14:34:13 EDT 2004 | tjensen
There are many factors that can lead to solder balls. Since you have just recently seen this start to occur, it is obvious something has changed in the product or your process. Since we don't have a lot of details about your process, I would sugges
Electronics Forum | Tue Jul 27 17:23:45 EDT 1999 | M.L
| | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | 12BGA per assembly | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | Pads .014inch | | | | Vias within footprint .020inch | | | | Vias to be filled by b
Electronics Forum | Thu Jun 12 03:37:05 EDT 2008 | benefon
It is also possible to etch the barcodes directly on the PCB by using a laser. The solder resist mask is easily burned by laser and if there is copper underneath the contrast is quite good. The contrast is satisfactory even if there is no metal under
Electronics Forum | Thu May 07 21:25:56 EDT 1998 | D.Lange
| I am running a board that is .062" thick and has components that over hang the edge of the board by .090". I have bottom side smt components (chip caps and resistors only) and use the turbulent wave to help solder the components. The problem I am
Electronics Forum | Tue Jul 27 17:54:37 EDT 1999 | Earl Moon
| | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | 12BGA per assembly | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | Pads .014inch | | | | | Vias within footprint .020inch | | | | | Vias to