Electronics Forum | Wed Jun 30 10:00:33 EDT 1999 | Mcox
| | | | | | | | snip | | | | | | | | | John and Dave, | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the pa
Electronics Forum | Wed Jun 30 11:07:16 EDT 1999 | Earl Moon
| | | | | | | | | | snip | | | | | | | | | | | John and Dave, | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us d
Electronics Forum | Fri Aug 21 13:43:13 EDT 1998 | Ben Salisbury
| Hello everyone, | I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible s
Electronics Forum | Fri Jun 15 13:17:27 EDT 2001 | CPI
Are you exposing so you can solder and SMD component directly to it? If not are there ant vias near by that connect to the area you are trying to expose? If not I have done as Dave suggested using a dremal tool. Messy but it works.
Electronics Forum | Wed Apr 21 13:21:33 EDT 1999 | Scotty
Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The process
Electronics Forum | Mon Apr 07 21:08:52 EDT 2003 | Satbir
Is this safe to wavesolder the PCB in wave contaning carbon pads for switch or somekind of masking is to be put on that pads.
Electronics Forum | Mon Jan 26 04:13:48 EST 2004 | patthemack
First of all, did you profile this board with a mole, such as a KIC? Is the solder flowing, or just not wetting to the part or pad? I work with RF boards as well, but the main problem is tombstoning due to the ground plane side being larger because o
Electronics Forum | Tue May 10 17:50:08 EDT 2005 | davef
Consider: * Changing your temporary solder resist [TSR] to a light cure. * Contracting with your board fabricator to apply the TSR. * Gaining better thickness control of your application process by silk screening the current TSR. * Forcing more air c
Electronics Forum | Mon Jul 24 10:15:23 EDT 2006 | slthomas
Set-down height to low, iow, parts getting squashed too deeply into the paste. No mask between pads on fine pitch. Pads too wide for the pitch.
Electronics Forum | Fri Feb 23 18:55:39 EST 2007 | greg york
burns and melts in the pot sending the solder golden/yellow and drosses like mad. Lackwerke pieters germany ( not sure on spelling) Lead Free version works well,if you need the exact code I will get for you. cheers greg york
