Electronics Forum | Fri Mar 24 17:07:39 EST 2000 | John Thorup
Hello Ashok If you are talking about the thousands of volts that is often generated by either simply unrolling the tape to apply or when it is removed from the board after soldering you don't have a lot of choice since it is an insulator. Ionization
Electronics Forum | Tue Dec 04 10:30:16 EST 2007 | slthomas
Q: The question I have is do they wet in wave solder, and if they do, why does it matter what happens to them in reflow? A: Yes, but somebody here don't agree with me that the glued part need help from wave to get the good wetting. They are wrong
Electronics Forum | Tue Feb 13 07:26:26 EST 2001 | doctord
Bill, I can give you suggestions. First and foremost. Print a board and look under a microscope. Are you printing exactly on the pads? If you print on the mask, no matter how good we got the profile, no matter what paste we would get solder balls. Mo
Electronics Forum | Mon Jul 26 12:55:34 EDT 1999 | M.L
Presently protos of micro-bgas (80i/o) pitch .030/.031 12BGA per assembly The board is a (.062, 4 layers) FR-4 using Dry film Pads .014inch Vias within footprint .020inch Vias to be filled by bottom side(solder side) only .030in dia. Force via plugg
Electronics Forum | Fri May 10 14:02:05 EDT 2002 | pjc
First off what bone-head designer put them there in the first place. Vias in solder lands is a big time no no. I had this problem at a CEM I worked at. I had the customer change the design but had to run the 6 samples they supplied. I ended up fillin
Electronics Forum | Thu Jun 06 07:28:30 EDT 2002 | cyber_wolf
It has been my experience that the only thing(s) that will ever cause this is: 1. Operators with paste on their hands. 2. Paste on the screen printer tooling. 3. Paste on the bottom of the stencil. Even very very small amounts of paste on the gold fi
Electronics Forum | Fri Feb 24 13:39:35 EST 2006 | Chunks
I agree with Jerry. A 7 mil stencil should work just fine for 25 mil pitch parts and 0.050 pitch BGA's. I too go 6 mil, but whith proper screen printing, you can 7 mil. You can always do 5 ot 10% reductions if needed. Use the homeplate design on
Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy
Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus
Electronics Forum | Thu Sep 26 11:53:40 EDT 2019 | scotceltic
Experiencing some solder balls on an SSO-36 package. Things I am planning on checking are as follows: (not necesarilly in this order) I am just looking for a sanity check to see if you would try other things to help ? 1) Reflow profile. I have he
Electronics Forum | Wed Jul 07 10:25:13 EDT 1999 | John Thorup
| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. | | John, | It depends......mainly on the via size. Tenting works on smaller vi
