Electronics Forum | Wed Dec 11 10:25:46 EST 2019 | engmagana
Dear Ameen, We have proved to the customer than the solder fillet obtained after the solder reduction is enoug by bracking some parts and obtainig more than 200 Newtons before and after, the problem has deminish but not yet solved , next step is re
Electronics Forum | Sun Oct 10 18:53:04 EDT 1999 | Dreamsniper
| | | | Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | | | | | | | PCB is FR4 | | | | Solder Mask is LPI | | | | Reflow and W/S Profile =
Electronics Forum | Thu Dec 24 08:44:25 EST 1998 | Earl Moon
| | | | Folk's, | | | | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colou
Electronics Forum | Thu Feb 24 11:05:53 EST 2000 | Russ
I usuallly like to have the pad size the same size as the ball up to +2mil, the pcb solder mask opening to be +4 mil from the pad size (I have found this to aid in Xray inspection for opens since you can see the little tail of the solder wicking up t
Electronics Forum | Wed Apr 25 16:08:24 EDT 2001 | jmills
We build a product that requires a lithium battery. There is a Smt Battery clip soldered onto two gold pads on a FR4 PCB. The battery is forced by two little clips punched out to provided downward pressure in the battery holder, enabling the lithium
Electronics Forum | Wed Apr 25 16:09:45 EDT 2001 | jmills
We build a product that requires a lithium battery. There is a Smt Battery clip soldered onto two gold pads on a FR4 PCB. The battery is forced by two little clips punched out to provided downward pressure in the battery holder, enabling the lithium
Electronics Forum | Wed Apr 25 16:12:18 EDT 2001 | jmills
We build a product that requires a lithium battery. There is a Smt Battery clip soldered onto two gold pads on a FR4 PCB. The battery is forced by two little clips punched out to provided downward pressure in the battery holder, enabling the lithium
Electronics Forum | Tue Mar 27 09:06:10 EST 2001 | dblsixes
We have tried to adjust the upper and lower heaters. We have a dillema in this area however. The power supply portion of the assembly has thermal vias in the solder pads underneath larger pads. We have a problem with solder wicking through these h
Electronics Forum | Fri May 02 09:37:23 EDT 2003 | Jerry Magera
Via in pad is the most efficient use of space. Blind via seems to be blamed for this. Cross-sections (send me some) will probably show a void still existing in the via or spherical voids aligned near the component pad side. One can estimate the vo
Electronics Forum | Thu Oct 25 13:35:47 EDT 2012 | davef
Here's a paper that may help http://www.ipcoutlook.org/pdf/assembly_challenges_bottom_terminated_ipc.pdf Temperature Impact * Profile didn’t have a significant impact on voiding. * Voids slightly increased with higher temperature. Reflow Atmosp
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