Electronics Forum | Fri Mar 25 05:33:18 EDT 2011 | Nigel, RAKON
We have the occasional solder fine but the main issue I have is with small - large balls of solder around an 0402 capacitor. Our LF paste data sheet states a %rH of 25 - 70, I have recorded an average for March of 14.9 - 38.5 %rH. Every other requirm
Electronics Forum | Sun Apr 04 00:51:01 EDT 2010 | jmelson
On the Xilinx chips, I am pretty sure these hairs are NOT tin whiskers. The solder in this particular build was SnPb, and pure tin would almost certainly melt at soldering iron temperatures. My theory is that slivers of the lead frame material, lik
Electronics Forum | Fri Mar 25 10:50:01 EDT 2011 | grahamcooper22
3 deg / sec) then the flux can slump from the paste and solder is carried with it off the pad and will form balls. Finally, are your pcbs dry ? Pass a bare one through the reflow oven before you print any paste on it, let it cool and then process as
Electronics Forum | Fri Jun 01 01:07:13 EDT 2001 | Brian Sloth Bentzen
I would be very interested in informations on OSP (organic solderability protection) on PCB�s. Good or bad experience with solderability, storage etc. There must be different types / brands of OSP. What type should be prefered ? And if possible
Electronics Forum | Thu Jul 05 01:45:02 EDT 2001 | Brian Sloth Bentzen
Yes, the solder pad on the PCB should match the pad on the part. This will minimize stress during the soldering process�. Check out more on http://www.smtinfocus.com/papers_pbga.html Here you will fond some more informations on the process used in r
Electronics Forum | Mon Aug 26 09:02:53 EDT 2002 | blnorman
Our requirement is 2 hours after printing before the board needs to go through the oven. Course we're in the humid south where on those 95%+ RH days we do get solder balling.
Electronics Forum | Wed Dec 10 10:05:07 EST 2003 | davef
We do not have experience soldering to the PVD surface you plan to use. We use Titanium [Ti] stiffeners in wave soldering and our wave equipment manufacturer uses Ti fingers, nozzles, pump blades, and other parts, because solder doesn�t stick to Ti.
Electronics Forum | Thu Jul 26 17:43:57 EDT 2007 | tphan
Board had a via hole underneath of the solder pad of the BGA. When it run through reflow oven, it caused a lot of void. How to correct this issue?
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