Electronics Forum | Tue Sep 20 17:09:14 EDT 2005 | hly
I have a situation with hot boards with fine pitch BGAs that I need to build. However, there is a big problem--the auto screen printer is down. I decided that we would use the stencil and manually line up the pads and do a manual print. I can't ac
Electronics Forum | Mon Dec 22 15:35:18 EST 2003 | davef
Marc: Please be more explicit. * When you say, "parts have a metal shell"; are you talking about the component leads or the component body? What is the metal, what is it appearance, and what are it's implications? * When you say, "the parts have a
Electronics Forum | Wed Sep 21 16:25:43 EDT 2005 | GS
IPC-7525 tells you how to make stencil apertures for BGA IPC-7095 tells you how much should be the paste volume in order to get a reliable BGA solder joint. How are your PCB finisced? (HASL, ENIG, OSP, etc?) In case of not HASL, it could be necessa
Electronics Forum | Wed Oct 19 11:33:15 EDT 2011 | caerleon
easier if you recycled on-site? You can still send off for reclaimation the oxide powder that your left at the end of the process. Failing that talk to your supplier to see if they have arrangements to do this for you or look at reducing dross - i f
Electronics Forum | Wed May 11 13:27:30 EDT 2005 | Sam Ho
i want to know which type of solder paste and reflow profile can support the solder pad with nickel but not covered gold on the pcb.
Electronics Forum | Tue Apr 04 16:39:41 EDT 2000 | Kevin Facinelli
Does anyone have any good information on alternative solder paste materials like the Emerson and Cuming CE 3103. I would be interested in any information anyone may have on these new materials...... Thanks, Kevin
Electronics Forum | Wed Sep 21 01:57:40 EDT 2005 | hly
Hi K, Thanks for your reply. I was wondering if there is an industry spec that specifies a minimum required solder volume for BGA joints? Thanks HLY
Electronics Forum | Wed May 11 13:50:30 EDT 2005 | russ
I would contact your paste supplier, bare nickel can be impossible to wet to. How oxidized is it?
Electronics Forum | Thu Jul 26 23:43:49 EDT 2007 | gioblast
check your stencil design on the ground pad. You might have a big aperture opening that pushing the component away from the paste. Look alos the way your pcb warp. Prioritize side that has component that need flat pcb as much as possible. hope this h
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
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