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Electronics Forum | Wed Aug 12 04:37:14 EDT 2009 | sachu_70
SAC305 has a liquidous state temperature 217 degC. Check the datasheet to compare to this temp. I suppose, it may be lower. - Cheers !
Electronics Forum | Wed Aug 12 14:37:41 EDT 2009 | davef
Try this: http://www.pwbrc.org/members/pdf/works99/Hua.PDF
Electronics Forum | Fri May 14 09:00:35 EDT 2010 | rafacadiz
I attached a RX picture. A lot of voids and micro balls arround the flux residue. What do you think, relow temperature reflow or OSP poor weeting.? I appreciate your comments. Thanks,
Electronics Forum | Mon Feb 28 07:36:56 EST 2011 | davef
Kim Here's an approach to posting pictures: * On your posting, clickon 'Edit' * Scrolldown past the 'Quote' 'Preview' 'Post' etc line * Clickon 'Attachments' * Enter your picture location * Select the choice that allows viewing the picture * Close ou
Electronics Forum | Wed Aug 09 10:51:22 EDT 2017 | cbeneat
I have a question for the experts. After a panel is printed, how long is too long for the panel to sit prior to reflow? I understand each paste will be different, wondering if there is a general rule of thumb?
Electronics Forum | Wed Aug 09 12:34:54 EDT 2017 | jdengler
It also varies with the types of deposits. Small deposits of paste (as seen on fine pitch parts or small chips) seem to be more affected by exposure. Jerry
Electronics Forum | Tue Aug 15 07:27:03 EDT 2017 | emeto
Most important factor - temperature. Back in the days I worked for a place without AC, and summer time this paste couldn't make it for more than an hour. In controlled environment you will be safe for hours or even a shift.
Electronics Forum | Mon Sep 20 13:04:25 EDT 2004 | davef
The Intel BGA Developer�s Guide [ http://developer.intel.com/design/packtech/ch_14.pdf ] says: 14.8.3.3 Plated Through Hole (PTH) Isolation Regardless of the technique used for the mounting pads shape or definition, isolation of the plated through h
Electronics Forum | Tue Jan 05 18:07:53 EST 1999 | Dave F
| I am looking for information regarding post wave soldering of stranded wires into a circuit board using OA core wire solder. We do a final pass thru the cleaner after the hand soldering but I'm concerned about any OA flux residue that may have wic
Electronics Forum | Thu Nov 21 06:36:30 EST 2002 | Ben
I'm doing SMT of lead-free solder BGA on FR4 Ni-Au PCB. The solder paste I'm using is Sn/Ag/Cu and reflow with peak temp at 240C. I found there are voids(1-2) in almost every solder joint(500 micron in dia) under xray. And the void size is violate th
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