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Electronics Forum | Mon Nov 26 13:40:40 EST 2018 | robl
Hi Prem, Yes, the flux in the Cobar paste helped with wetting and joint strength, as does reducing voids as there is more solder in the joint, as does cooling rate. Regarding peel test in KG, it depends on the pad size and volume of solder in the j
Electronics Forum | Fri Jan 04 06:28:27 EST 2019 | ameenullakhan
Hi, We are observing solder joint discoloration ( yellow color appearance ) in one of assembly after secondary reflow run. Please provide your valuable feedback. Solder paste : water soluble lead free Alloy : SAC305 Flux : ORM1. Please provide v
Electronics Forum | Mon Feb 18 07:49:17 EST 2019 | SMTA-Joe
the tarnishing is happening across all the traces without solder even being applied. The PCB is soldered into the housing first. Once this is complete the traces have changed, and when it is time to solder the components to the traces this tarnishing
Electronics Forum | Wed Dec 11 14:38:25 EST 2019 | slthomas
The one thing I haven't seen mentioned yet is developing the the control systems for the process equipment and materials. You don't want to mix up your solder paste, bar, and wire, and you don't want to cross-contaminate by using equipment (solderi
Electronics Forum | Tue Dec 31 10:17:12 EST 2019 | emeto
Let's stay away from the PCB and process for a while. This component is pre-tinned. What kind of solder? How is the component stored? I bet you that you can put just flux on the board and solder this part - have you tried? I think we should understan
Electronics Forum | Fri Apr 16 17:44:12 EDT 2021 | dwl
I'm concerned by the solder spheres in the via on the first picture. Are these boards mis prints that got washed and printed again? To me it almost looks like someone washed the board, but left a lot of solder paste on it. The lack of flux prevents
Electronics Forum | Thu Jan 13 22:45:50 EST 2022 | tey422
Seem like extra soldering would really helps it. Adding solder beads by using pick & place machine is more of a consistent way to add extra solder where you need it the most. No matter how you modify the stencil, there is still limits how much you ca
Electronics Forum | Tue Sep 07 09:11:33 EDT 1999 | Dave F
| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
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