Electronics Forum | Sun Apr 05 08:02:32 EDT 1998 | Helmut Pawelka
Dear Peter, out of the manufacturers sight, Steve is 100% right. The manufacturer gives a guarantee for at least 6 Month because we know from our own test, that the homogenity is one of the most important parameters for a good printability. It could
Electronics Forum | Sun Apr 05 09:25:12 EDT 1998 | Earl Moon
| Dear Peter, | out of the manufacturers sight, Steve is 100% right. | The manufacturer gives a guarantee for at least | 6 Month because we know from our own test, that | the homogenity is one of the most important parameters | for a good printabilit
Electronics Forum | Tue Mar 19 00:14:47 EST 2002 | ianchan
Hi Guys, Can anyone help us out here, please? We need to know what formulae (other than Length(L)xBreath(B)xheight(Z)), is used to determine what volume of paste is required for 20mils pitch leadless chip carrier (LCC28), for the paste printing pro
Electronics Forum | Mon Jun 17 21:18:24 EDT 2002 | davef
I don't understand "well we can't paste the flip chip on its substrate because we are using flux". There is flux in paste. What's the difference? If you use solder paste, there will be more room for underfill, as compared to flux only. Some peopl
Electronics Forum | Wed Jul 31 14:08:22 EDT 2002 | Dave G
Used this paste on ENIG boards W/O N2 and had very good results. (0402's,BGA's,16mil FP) Never had the need to use N2 with this paste on our products. Running with N2 shouldn't hurt anything. The wetting properties should get even better than they ar
Electronics Forum | Tue Feb 11 12:59:26 EST 2003 | matherat
The assembly process involves activity before you get to reflow. Reflowing is the easy part. Putting paste down and placing parts in wet paste is the terrifying part. Benchtop reflow ovens can be a real handy tool for small production but with the g
Electronics Forum | Thu Aug 21 15:10:59 EDT 2003 | paulm
Such balls (=/- 0.004)size variance can occur in a single part. If I have a ball in a part that could be (according to vendor specs) 0.008 larger than another ball the only way I can insure that the smaller ball makes contact with the paste is to hav
Electronics Forum | Thu Sep 25 12:59:14 EDT 2003 | successmani
hi, I am a research student in Electronics manufacturing at RIT. We are planning to assemble boards using lead free solder paste. I was wondering would there be any changes in printing in using lead-free paste"Sn-3.9Ag-0.5Cu". Thedensity of Sn-37Pb
Electronics Forum | Thu Dec 18 21:36:03 EST 2003 | pdeuel
Blade angle, print speed, squeegee pressure, should be used in conjenction with one another. The more parellel the blade is to the stencel the more it will tend to float over the solder and the more paste is forced thru the appature. Contrary the gre
Electronics Forum | Wed Aug 09 01:58:51 EDT 2006 | tk380514
OK i have a question: I have a prototype BOM and i suggested the customer that we use Paste-in-hole for the 1 connector that they want to use, but its quite high component and not very wide: http://www.molex.com/pdm_docs/sd/022272051_sd.pdf If i u
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