Electronics Forum | Wed Feb 21 14:14:11 EST 2007 | rgduval
Hi, Bill, Lead-free solder and paste manufacturers will be a great resource for you during the transition; they've tested their products extensively, and their application groups have been able to help me through the biggest changes. There are a fe
Electronics Forum | Wed Feb 17 15:56:22 EST 1999 | Tuffty
| Dear Al, | Are these reworked, double-sided boards? | | If you attempt to clean side #2 of double-sided misprint in a "spray" type cleaner, millions of solder balls can be broadcast throughout the same chamber as the populated side #1. Or, if thi
Electronics Forum | Mon Jun 21 11:14:25 EDT 2004 | exmaintenanceleader
Dear Kanwaljit Singh, my opinion is following: 1)solderpaste type is ok - usual (alpha-metals has this problem inside the paste paste- holder problem) - what do the operator when production change -clean well the stencil holes!! no visible rest on
Electronics Forum | Thu Mar 29 15:29:11 EST 2001 | johnw
measuring Paste volume or at least paste height is an essencial part of any SMT process. You've got to control those input's.... Paste volume determines how much solder is available for your joint so theres a direct to joint reliability / PCB reliabi
Electronics Forum | Thu Jul 20 12:49:05 EDT 2000 | Bob Willis
So far on all my trials on PIHR I have only used standard products as the paste is defined by the printing requirements for fine pitch etc. As most people will have seen you just get a heap more residues with this process and even more with lead free
Electronics Forum | Mon Jul 20 14:47:37 EDT 1998 | Justin Medernach
| We currently use an ESP RMA paste. The reason that I initially posted the question was because we are conducting tests to see if this is infact the best paste for our processes. In running tests, however, certain variables, such as humidity, are
Electronics Forum | Wed Nov 07 11:56:44 EST 2001 | mparker
Pad spacing is just one element to consider. Your pad spacing is determined by the pitch (center to center distance between the leads). There are several good resources to find the appropriate pitch per device. Search the archives here or refer to th
Electronics Forum | Mon Nov 26 14:49:20 EST 2001 | mparker
1. The formula for cubic area (LxWxH) applies to get the expected volume target value. Caution- do not assume the pad surface square are is correct for the part. Do consider the footprint of the device beign placed and its solder requirements to cre
Electronics Forum | Mon Nov 01 16:41:58 EST 1999 | Robert Culpepper
Hello Mark, I can�t provide any hands on feedback with 0402 packages but we are using a no clean process with 0603 devices. Here are some parameters which will affect solder balling. Stencil thickness, aperture size, paste viscosity, snap off and bot
Electronics Forum | Tue Jul 28 02:28:48 EDT 1998 | Bob Willis
The causes for solder on gold are: Paste wash offs Dirty stencils Dirty under stencil cleaning cloths/no solvent Poor handling The most common reason is wash offs when there is a couple of balls left on the tabs and they reflow. With correct profile
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