Electronics Forum | Fri Jan 16 13:11:27 EST 2009 | evtimov
HI , A LOT OF SIMILAR ISSUES WERE DISCUSSED LATELY. MOST OF THE TIME THE PROBLEM IS IN THE BOARD FINISH. THE BEST OPTION IS GOLD FINISH(ENIG). MAKE A SAMPLE AND TRY IT WITH BOTH PASTES YOU HAVE. ANOTHER THING I DID BEFORE AND IT HELPED ME PARTIALLY
Electronics Forum | Mon Aug 03 15:04:03 EDT 2009 | davef
We know nothing about your: * Solder alloy * Materials of your board * Materials of your teminal block * Process setup of your wave * Wetting condition of the board or the terminal block ... but we'll take a guess anyhow. Tin-copper based solder all
Electronics Forum | Thu Aug 13 10:58:58 EDT 2009 | davef
First piece of advice: build the board as you would any other board. Probably, you will be surprised at the holding force of the solder of the connections of the BGA, because the surface area of the solder is very large compared to the weight of the
Electronics Forum | Wed Aug 26 05:13:01 EDT 2009 | grahamcooper22
Hi, as you are using Vapour phase reflow what temperature is the boiling point of the solvent you are using ? If it is @ 250 C then you should be getting everything hot enough to melt the ball and solder paste together. If this is the case then your
Electronics Forum | Mon Jan 10 16:58:48 EST 2011 | piter
Hi Ripal it seems that you have problem with compatibility of alloy and quality of solder balls. First check solder alloy form BGA balls what is it?(SAC105,SAC305, etc.) what type of solder paste you use?? third thing is what type of finishing you h
Electronics Forum | Tue Mar 01 15:13:22 EST 2011 | felixgutierrez
Hi Everyone. I would like your input in regards to lead free solder paste lead free. Which one is the most reliable solder for BGA's and BTC's (QFN). I have used different type of solder and on some of them i get big voids on BTC's and other one i g
Electronics Forum | Fri Jun 10 13:04:04 EDT 2011 | spitkis2
Any suggestions as to what can cause a PBGA's corner to warp down during installation process on a rework system? A couple solder balls bridge at the corner. It appears at the pin 1 corner where the metal indicator of a BGA is exposed. I am wonder
Electronics Forum | Mon Oct 10 14:03:07 EDT 2011 | adp23
I have a few questions regarding Solder products being UL Listed or Recognized. I am aware that UL does test solder material (conductive material) using the UL 746 standard. However, i would like to know if UL actually recognizes the conductive mater
Electronics Forum | Fri Jun 29 12:47:25 EDT 2012 | deanm
We are experiencing widely varying First Pass Yields for selective soldering. Some boards are near 100% while others are less than 50% depending on the pitch and general complexity of the board. Question: If you are running 100 boards through your s
Electronics Forum | Wed Oct 29 18:18:34 EDT 2014 | jorge_quijano
Hola Grayboard, I've had the same situation with these components, I changed the stencil apertures a little bit and use a stepped stencil (5-6mil), after some trials we were able to get decent yields, but we still had some failures, what we discover
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