Electronics Forum | Fri Jun 26 04:26:11 EDT 2015 | grahamcooper22
In the EU these companies have great equipment and experience with laser soldering systems...you have to make sure you use the correct wire / paste....Almit is the best. http://www.wolf-produktionssysteme.de/en/ http://www.mtaautomation.com/ Maybe c
Electronics Forum | Sat Sep 16 15:50:48 EDT 2017 | ctran
An assembly with this improperly solder joints will have functional issues. We have encountered this many times with memory modules failures,RMA units. Reflow always solved the problem (in our many cases). Dwelling time may be the key to solve this.
Electronics Forum | Wed Jan 04 07:32:35 EST 2017 | pavel_murtishev
Good day, Having recieved new batch of PCBs with OSP surface finish, I have noticed that some polygons not covered by solder mask and solder paste become darker after second reflow cycle compared to PCBs not being sent to reflow. I wonder whether i
Electronics Forum | Fri Aug 18 03:46:29 EDT 2017 | stivais
The first reply from Tsvetan Usunov already answered your question - there are no thermals for one side of the chips. You can try to reduce the phenomenon by using different solder pastes, tuning your soldering profile or even switching to different
Electronics Forum | Thu May 17 03:23:44 EDT 2018 | shuhaib
the D-PACK IC are falling down in primary side while second side reflow soldering. the solder paste volume is ok. reflow time ( TAL ) is less than primary side. but still issue is happening. let me konw how to prove it is DFM issue, because its hea
Electronics Forum | Thu Jul 25 18:41:52 EDT 2019 | myke03o
Hi I have solved the issue. The component cracking are the big 1210, 0603 and 0402 capacitors. After studying and testing in many type of solder. The best to use is SnPb and the components are the key - there are component which will tend to expand
Electronics Forum | Thu Sep 05 10:15:58 EDT 2019 | SMTA-Richard
There are multiple solder alloy options and we have tested many of them in a consortium project. There also are very specific challenges associated with testing using the -40/150 C profile. This is way too complicated to discuss in a chat room. Se
Electronics Forum | Thu Sep 05 11:05:35 EDT 2019 | SMTA-Tony
There are competitors to REL solder alloys from AIM. Tin-Copper-Nickel-Bismuth alloys (Nihon Superior) are an alternative option which do very well in thermal cycle testing. The reflow profiles required are similar to SAC305 profiles. You may als
Electronics Forum | Wed Jul 18 07:11:22 EDT 2018 | ir11
Dear SMT Experts, Just want to seek for expert advice regarding Ceramic PCB. Our Customer want to run ceramic PCB and want to understand the challenges that we might encounter. Anyone have their experienced running or dealing with Ceramic PCB, what
Electronics Forum | Wed Jul 18 07:30:18 EDT 2018 | ir11
Dear SMT Experts, Just want to seek for expert advice regarding Ceramic PCB. Our Customer want to run ceramic PCB and want to understand the challenges that we might encounter. Anyone have their experienced running or dealing with Ceramic PCB, what
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