Electronics Forum: solder paste inspection (Page 501 of 747)

Glenbrook Technologies X-Ray: Anyone using this??

Electronics Forum | Thu Jun 24 09:19:31 EDT 2004 | Cal

The Angle view (or Variable Angle Viewing) gives you another perspective on joint inspection. Glenbrook has two great illistrations on the varible angle viewing literature (.pdf file): Here are a few examples: 1) Looking straight down on the ball..it

BGA Inspection Equipment

Electronics Forum | Mon Jul 19 09:53:07 EDT 2004 | Mighty C

Good Morning Rush Fan, We have a Metcal VPI 1000. We are very happy with the system. The price is competitive, software is easy to use and the picture quality is good. They have a great lighting scheme that illuminates under a BGA extremely well. Th

X-ray capabilities needed for Xilinix 1152-ball BGA

Electronics Forum | Thu Feb 03 13:23:30 EST 2005 | caldon

Hi Steve- We have a Glenbrook system and are pretty pleased with it....as far a value vs. cost it works great. I did have an issue with a Soic with a ground plane in the center...yes SOIC!!! The Ground plane was a heat sync that had vias for thermal

Touch-up and Inspection Process

Electronics Forum | Wed Mar 02 18:46:02 EST 2005 | Austinj

The tendancy always has been "when in doubt, touch it up"... this is not the way to "verify the process" and is not the best strategy for multiple reasons (unessecary rework, additional labor costs, as well as making the solder joint more brittle, [i

Reliability assessment SnPb joints to lead-free component

Electronics Forum | Thu Jun 09 05:04:05 EDT 2005 | Joseph

Dear Patrick, Unfortunately we do not know what exactly the failure as our customer refuse to reveal to us. From visual inspection the solder joints are smooth and shiny as per IPC-A-610 requirements. The component supplier (IR) commended that they

How do you identify Lead Free Boards from Sn/Pb?

Electronics Forum | Thu Oct 06 09:11:14 EDT 2005 | russ

We use a diffrent colored traveller to identify the pbfree vs. other if you will. During our First article inspections we verify that the correct solder is being used per documentation and that the correct traveller is being used for that build. As

Solder Ball After Reflow Process

Electronics Forum | Sat Aug 19 14:12:13 EDT 2006 | Wave Master Larry

LISTEN I'll have to disagree Steve.i think this Chunks person oversimplifies stuff and I dont like her style I'm surprised because most orientals do better with analyzing stuff.reminds me of some engineers at my place of employment.Again Im fighting

AOI

Electronics Forum | Thu Sep 07 09:32:14 EDT 2006 | tony_d

Hello Saaitk, I was recently tasked with selecting an AOI system for our company. We are a low to medium manufacturer as well. I looked at several different vendors and narrowed the field to Mirtec and Yestech. I found that the programming was v

MC33982PNAR2 (aka PC33982BPNAR2) PQFN

Electronics Forum | Fri Oct 20 11:23:33 EDT 2006 | mmjm_1099

Good morning/afternoon/evening everyone! I am seeking the assistance/guidance of anyone who has had practical experience with placing, soldering, and rework of this particular component. One of our customers is looking to use this component on quit

Clearance between Through hole and chip component

Electronics Forum | Wed Feb 28 00:01:47 EST 2007 | Muhammad Haris

Hi, The distance between the two terminations/endings/pads of 0603 (0201)is 0.15mm i.e. lesser than than the distance between the 0603 and through hole i.e. 0.5mm My ques is that, then why its termination doesnot short as it has a minimum distance.A


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