Electronics Forum | Wed Aug 17 14:18:11 EDT 2005 | ppwlee
Dave, Answers to your questions: * From your pictures, the white residue appears to be only on the solder mask. Is that correct? If not, what is the location [eg, solder, nonsolder/nonmask areas] of the residue that doesn't show well in the pictur
Electronics Forum | Mon Feb 13 14:34:31 EST 2006 | pjc
The best way to compare is ask each machine company to bring their machine in for a demo. Since they are bench-top machines, they are easy to transport. Pick one of your boards for them to run. Don't send any board data ahead of time. When they come
Electronics Forum | Wed May 07 21:20:53 EDT 2008 | davef
Causes of Delamination ["Quality Assessment of Printed Circuit Boards" Lund, Preben; Bishop Graphics 1985 0137450354] The reason for delamination is epoxy starvation in the glass cloth layers or an incomplete curing of the base material. It has been
Electronics Forum | Thu Dec 18 13:05:59 EST 2008 | tsvetan
we have omron, before buy I have evaluated lot of other machines, what I like most is the three ring at different angle lighting which allows pseudo 3-d solder joint evaluation and historgams with statistics, you can see out of total solder joints ho
Electronics Forum | Thu Jun 13 11:27:25 EDT 2002 | davef
>*Changing paste >EricD: Yes we are considering that as a point. Because I believe the paste we are using are in syringe packaged and designed for dispensing. We are using an Indium SMQ75 paste and current application naturally is stencil printing.
Electronics Forum | Mon Nov 05 16:54:00 EST 2007 | bbarton
There are several things that can be done to increase throughput on you screen printer, including the panelization of your bords as Steve & Hussman has pointed out. However that's of limited use if you have plenty of stock that is not panelized. That
Electronics Forum | Tue Sep 15 12:11:36 EDT 1998 | Bill Schreiber
Jeff, The use of flux thinner would only add another chemical to the process. Environmentally, that would not be a good idea. My guess is that you would only end up with "thinner jelly" anyway. Alcohol works well on RMA flux. When assemblers switch f
Electronics Forum | Wed Apr 08 12:29:08 EDT 1998 | Justin Medernach
| Is it just me, or does anybody else have problems with open connections on small surface mount headers and connectors? I am talking about small 20 to 40 pin devices, 25 to 50 mil pitch. We put these things on the board, the feet look like they ar
Electronics Forum | Wed Nov 20 03:52:16 EST 2002 | iman
Hello, need help on intrusive reflow process, thanks in advance to the experts and general info sharing :) need some help to obtain answers, to following questions: 1) PCB is FR4, 1.6mm thick, 4 layers, what stencil thickness (stencil design guide
Electronics Forum | Fri Feb 10 12:21:44 EST 2006 | Cal Kolokoy
DaveF is correct in saying that TAL is not the best metric to use in reflow soldering. That is why paste manufacturers give such a wide range; typically 30 to 120 seconds. The peak temperature is more important, especially in the mixed Pb and Pb-F
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