Electronics Forum | Tue Jan 21 13:40:00 EST 2014 | rgduval
If you're using the Kapton tape to protect the gold fingers from solder splatter, my first instinct is to say,yes, you do need it. I've had the pleasure of paying to have gold fingers reworked in the past. It is not in-expensive; certainly not equa
Electronics Forum | Wed Jan 08 16:27:11 EST 2020 | rmitchell
We have a PCB with the dual sided connector that slides on from the edge and has leads on the top and bottom sides of the PCB. It has 20 leads on each side of the PCB with with about .8mm pitch. The PCB also has a gold grounding strip on the edge fo
Electronics Forum | Thu May 04 01:52:17 EDT 2023 | davef
Look at IPC-7526 - Stencil and Misprinted Board Cleaning Handbook, Misprinted Circuit Board CleaningCLEANING [ https://www.multi-circuit-boards.eu/fileadmin/user_upload/downloads/leiterplatten_design-hilfe/ipc-7526.pdf ] ITW/EAE says "Typically, th
Electronics Forum | Mon Nov 29 13:09:12 EST 1999 | Mike Konrad
There are three primary methods of stencil cleaning. � Hand Cleaning � Spray-In-Air Cleaning � Ultrasonic Cleaning Hand Cleaning: Hand cleaning involves the removal of solder paste or adhesives from stencils using a chemically saturated wipe and /
Electronics Forum | Wed Jan 31 01:41:00 EST 2001 | pjc
Steve, I have no influence over conn design. We paste print-reflow solder two types of connectors. One is a 50 pin IDC w/ 0.5mm lead dia @ 2.54mm lead pitch and a chamfered pointed lead tip. The other is 32 pin DIP w/ 0.36mm lead dia @ 2.54mm pitch
Electronics Forum | Thu Sep 16 18:07:16 EDT 1999 | Earl Moon
| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco
Electronics Forum | Wed Jul 14 11:27:41 EDT 1999 | Michael Zadrejko
I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it t
Electronics Forum | Mon Apr 19 14:38:01 EDT 1999 | Chrys Shea
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Mon Apr 19 22:52:59 EDT 1999 | Dean
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Tue Apr 20 23:18:48 EDT 1999 | KEVIN SIMPSON
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
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