Electronics Forum | Thu Aug 09 23:11:23 EDT 2001 | davef
Cheery disposition??? Would a few ;-) ;-) ;-) help? [Oh and look who is talking, the one planning the Mickie D gig after the traces on the this board start vaporizing with the fuseable link schtik.] Are you sure you're getting flux all the way up
Electronics Forum | Fri Sep 07 10:46:23 EDT 2001 | davef
Comments are: * Sn42Bi58 is eutectic at 138�C. Most top-flight paste suppliers will produce it for you. * Bismuth forms an alloy with lead with a melting point of 93�C * Maximum temperature of the solder connection should be less than 100�C during
Electronics Forum | Fri Oct 12 13:40:56 EDT 2001 | Steve
I need help with a process issue. I am dealing with a board design that is double-sided SM with a couple high density through-hole devices. I want to flow solder the through-hole stuff, so what is the best way to deal with them? Since one of the thro
Electronics Forum | Tue Apr 09 08:44:43 EDT 2002 | davef
Read IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)". There is no advantage in dropping off much faster than 4�C/sec. In fact, you risk fracturing your newly formed solder connections due to board warping
Electronics Forum | Mon Apr 15 19:01:53 EDT 2002 | Shawn
We have been getting solder balls on some of our SMT boards that are scattered across the board. We are using AIMS RMA291 in a cartridge. The profile we run matches what is called out on the tech data sheet for the solder with only the soak time mayb
Electronics Forum | Fri May 17 22:25:51 EDT 2002 | xzinxzin
*the other components are 0402 and SOIC 16, the solderability were good. *the protection on the terminations of microleadframe package is Cu(copper),somebody call that leadless leadframe package(LLP). *the time above 210 deg C is about 10 sec. *I us
Electronics Forum | Tue Jul 30 12:15:15 EDT 2002 | Rick Lathrop
Hi Dave, The paste applied to the board ends up on the tombstone. The pad has a thin covering of solder most of the time, this is why I think they call it a dewet. Occasionally the pad shows some areas of gold and very rarely are some pads not wet at
Electronics Forum | Wed Oct 09 20:52:27 EDT 2002 | davef
Russ, Be careful on how you determine your liquidous point. Sure 205-210�C is fine if your paste and the solderability protection on pads and component leads are near eutectic solder and things worked according to plan, but in real life it doesn't
Electronics Forum | Wed Oct 23 14:45:00 EDT 2002 | Tom G
I haven't tried anything like that but had some experience with .8 mm pitch SSOPs. Immersion depth in wave was very critical- had to control Lambda pump speeds within 20 RPM and even then it would change as solder level dropped. Need thieving pads o
Electronics Forum | Wed Feb 05 10:31:38 EST 2003 | bpan
Hello Everyone, Is anyone out there building smt boards that have plated through vias directly located through the pads. We are seeing some of these designs and the soldering is very poor because the solder is flowing through the via. We think that w
Capital Equipment Solutions - SMT | PCBA | TEST
Equipment Dealer / Broker / Auctions
113 S Main Street
Lodi, USA
Phone: 6083431779
