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Electronics Forum | Tue Mar 20 04:40:15 EDT 2018 | rob
I've seen them down at 2 metres in the past, but usually only 4 zone. from memory Electrovert used to do a small 5 zone with pin chain - Infraflow 500 or something. To be fair, even small one line CEMs usually have a decent oven as you need to be a
Electronics Forum | Tue Jun 26 16:07:12 EDT 2018 | eduszapata29
Minami vacuum reflow is easy to maintain air tightness, and oxygen can be reduced to 50ppm or less by filling N2 gas. And generation of oxide film can be suppressed, and production in low oxygen environment is possible. In addition to the air tightne
Electronics Forum | Wed Feb 13 09:30:32 EST 2019 | SMTA-Joe
*UPDATE* I decided to modify the experiment slightly by forgoing my attempt to achieve reflow with the component. Instead I applied SN42 paste directly to the pad and attempted reflow of the paste by itself. The end result is as follows: Hotplate
Electronics Forum | Fri Feb 14 12:22:57 EST 2020 | etmpalletguy
OK, you can't glue, Pallet Guys pallets are out the door, dual line reflow prevents from any lower temp solder paste.... Do you have a 3D printer? Are there parts underneath the connector in question? Measure the PCB thickness, pint out a custom hold
Electronics Forum | Thu Dec 17 15:53:32 EST 2020 | dwl
for option 3, if you place the connectors on the first pass then flip the board, won't the protruding leads interfere with second pass stencil printing? My vote would be to overprint onto the solder mask. you can print pretty far and still have it w
Electronics Forum | Thu Jun 30 13:07:56 EDT 2022 | emeto
I have used Bi based solder pastes before. What I can say about them is that they are brittle. Joints were cracking easily. This product is something new on the market, so it might be better. Keep in mind to test it for dropping and vibration and joi
Electronics Forum | Mon Jul 31 07:37:57 EDT 2023 | tommy_magyar
Hi Simon, Yes, red glue should help, assuming that it is being dispensed by a glue dispenser. For stencil printing I used yellow glue in the past (can't remember the brand). Your pick and place machine should be able to achieve on it's own 35 um
Electronics Forum | Thu Feb 04 18:45:56 EST 1999 | Earl Moon
| Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). Michael, In the "real wo
Electronics Forum | Tue Apr 14 15:50:45 EDT 1998 | Bob Barr
Justin, Thanks for the response to my dilemma. For once it's not just me! The parts seem perfectly solderable, but I will try the modification to the profile you suggested. I wonder if the retention clips may be letting loose from the holes they a
Electronics Forum | Wed May 12 16:31:25 EDT 2004 | Mark @ SolderStar
In answer to your questions. (1) pls can any body throw some light on the reflow profiling? Reflow profiling is the process of confirming that you PCB's that pass through your reflow oven are produced within specifications provided by solder paste
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