Electronics Forum | Thu Aug 07 16:52:49 EDT 2003 | craigj
We've been doing it for quite a while on some parts but are noticing that as more manufacturers are going lead free we are starting to see some issues. Particularily with pure tin on nickel. Have found that need to increase oven reflow temp and time
Electronics Forum | Thu Oct 16 00:08:31 EDT 2003 | Dean
Why would you have troubles if and when you switch? Isn't that the point of materials evaluation? Understanding the impact and material capability BEFORE "betting the farm on it". I would never stake my career on a solder paste without an Engineer
Electronics Forum | Wed Nov 12 15:48:36 EST 2003 | johnwnz
Thanks for the info Dave, the link provides very interesting reading! btw, JohnW and JohnWnz are one and the same, I've moved down to Sunny New Zealand to ply my trade / skills down here and have soem fun in the sun while I'm at it. A move I'd total
Electronics Forum | Fri Jan 02 14:04:56 EST 2004 | jjwhite
Has anyone had any experience with 60/40 Sn/Ni(300 u in.) over Ni(300 u in.)? If so, what kind of solder issues might exist with 63/37 Sn/Pb reflow? Is a different paste needed? Also, what is the benefit of using the same platings with a top plating
Electronics Forum | Thu Jan 15 10:08:54 EST 2004 | ADAM
Guys Does anyone have any design rules for a 121 pin BGA . The pitch is 0.031 thou, the ball diameter is 0.0115 thou . I would like to know the following : Pad and via sizes/type on the bareboard ? Stencil thickness and aperture size/sytle ? Solder
Electronics Forum | Mon Jan 26 21:10:36 EST 2004 | Vinny
I have done acurate profiling which meets the solder paste specifications. The point I am trying to highlight here is also due to the ground plane side being much larger causing the tombstone defect. I have even tried doing a linear profile, it hel
Electronics Forum | Mon Jan 26 11:10:56 EST 2004 | samaniegocesar
Hello to all of you, I'm running some small pcb's about 2.5x3.5 inches, can somebody tell me the zone temps and speed in meters/min that I have to use to get the best solder paste shine and best quality, is an oven of 8 zones. I apreciate your suppor
Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack
Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg
Electronics Forum | Wed Mar 17 17:30:53 EST 2004 | johnthor
hello Dreamsniper I'm assuming that you want an inexpensive yet accurate instrument to periodically verify your process/machines. A focussing microscope with a small depth of field is quite useful. You simply focus on the board, then refocus on the
Electronics Forum | Mon Mar 29 07:21:51 EST 2004 | jdumont
We are also having the same problem here. I was told earlier that it could be a problem with the solder mask during the raw board manufacturing level but then I noticed that the problem was only surfacing on boards that went through the wave. As far
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