Electronics Forum | Fri Sep 28 01:47:46 EDT 2018 | netvicher123
The followings may be the factors from your description: 1. chain speed and motor speed? 2. is the tin content even? (more or less on one side, or thickness of steel mesh, size of opening) 3. Is there any exception in the pin? 4. is there any level
Electronics Forum | Thu Jan 30 07:09:34 EST 2020 | jineshjpr
Hi All, I'm using 8 zone reflow for ROHS 0.2mm Thick PCB soldering, but Micro BGA shows voids more than 25%. Is there anybody can suggest for better solder profile. paste- aim m8, SAC 305, T4, Soaking (150-200) - tried 90s, 60s, 45s; TAL (>217)-
Electronics Forum | Wed Jul 06 15:26:12 EDT 2022 | glasscake
No experience with low temp solders for PIHR but we do use standard lead free 245-255 peak profiles on high temp connectors frequently. Honestly the added cost of the high temp connector pays for itself in labor. I almost always use oversized apertu
Electronics Forum | Sat Feb 12 10:33:31 EST 2000 | Francois Racine
First I'm a french people so excuse my bad english writing. I have a complete smt production line. First a screen printer DEK 240, a chip shooter PANASERT MVIIV, a multifonction machine MULTITRONIKS EP6000, a reflow oven at the end of the SMT line a
Electronics Forum | Mon Apr 17 18:42:32 EDT 2000 | Russ
Murad, I have just completed a switch over in our facility to no-clean. We used Alpha 609 and 857 paste and wave flux respectively. We currently use Alpha UP78 paste, NR330 wave flux, NR205 liquid flux for touchup and cleanline 7000 wire solder as
Electronics Forum | Tue May 29 16:52:07 EDT 2001 | hussman
By far the easiest way is to track solder paste measurement on your board - or solder defects after reflow (key word- easiest). Why spend 2 weeks examining a stencil when it clearly doesn't make defects, or IS making defects. I find using 2-D data
Electronics Forum | Sat Jan 22 20:59:51 EST 2000 | Jeff Sanchez
Michael, I am not sure if you are trying to lay out a board with vias in the pads or suffer through an assembly you got stuck with? I am building run of boards right now that has vias in most the smt pads. I'm sure the design group thought it was
Electronics Forum | Sat Oct 09 04:17:21 EDT 1999 | Brian
| Can anyone tell me the formula/method to determine | the amount of weight that solder's surface tension can support. | (ie: Maximum weight of components soldered onto a bottom side | of a board during a top side reflow on a Paste/Paste process). |
Electronics Forum | Sat Oct 09 07:33:23 EDT 1999 | Dave F
| | Can anyone tell me the formula/method to determine | | the amount of weight that solder's surface tension can support. | | (ie: Maximum weight of components soldered onto a bottom side | | of a board during a top side reflow on a Paste/Paste proc
Electronics Forum | Tue Aug 10 15:56:30 EDT 1999 | Jason Gregory
Has anyone ever heard of this? I have a Camalot System 5000 and we were in a pinch to produce some prototype boards. We needed Sn62Pb36Ag2-no clean in a dispensing mesh. All I could get my hands on was some Interflux paste in a jar. The formulation i
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