Electronics Forum | Thu Apr 29 10:24:15 EDT 2021 | oxygensmd
I have the same issue but with one customer only. All the other have smaller or more difficult QFPs with really low bridging issues - close to no-one. I think the PCB and PCB design also an issue - other customers are using 32/64/100/144 QFPs and we
Electronics Forum | Wed Dec 30 16:04:15 EST 1998 | former co-worker of yours
| I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. | | My current 0402 chip pad sizes on alumina and FR4 substrates are .
Electronics Forum | Mon Apr 01 19:57:07 EST 2002 | davef
Selective soldering machines are a good way to "finish automation", if the design of the PCB is conducive to the application with just a few components to solder. Your points are good. A decision matrix for selecting a machine might also include:
Electronics Forum | Thu Sep 11 11:45:28 EDT 2008 | realchunks
At first glance you would think so. But just as in real life manufacturing, EVERY problem can be solder related. Naturally the problems with broken parts, wrong parts, parts made wrong etc... are generally found right ways, so no one really posts t
Electronics Forum | Tue Jul 13 15:04:24 EDT 1999 | Scott McKee
| | | | Hi all , | | | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | | | 2. What type of stencil a
Electronics Forum | Mon Apr 23 17:30:08 EDT 2001 | davef
Step 1: Print paste on the board, skip placement, reflow the board, check solderability. Step 2: Goto Step 1. White Tin Solderability: The most common reason for solderability issues with the white tin surface coating during multiple thermal excur
Electronics Forum | Fri Jul 06 18:19:41 EDT 2001 | davef
The senior staff have the pictures!!! Oh, that�s just GREAT!!! What the blank are these gerbils doing with �em? Nothin�!!! They�re probably sitting in a folder on whatzisname�s desk, until he has "a change to study them more". [Like he�s going t
Electronics Forum | Wed Dec 01 22:34:32 EST 1999 | Dave F
Mark: Ralph Woodgate is a "god" of solderability control programs. We have: � Been attending his seminars for, maybe 8 to 10 years ... who keeps track when you�ve been breathin� fumes that long? � Three different editions of his "Handbook Of Machi
Electronics Forum | Tue Oct 05 12:42:43 EDT 1999 | Chris May
| I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via's
Electronics Forum | Fri Aug 20 14:22:02 EDT 1999 | Earl Moon
| | | I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. | | | Can any one tell me what I have to change in my SMT | | | process (paste, reflow, etc) If any? | | | I
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