Electronics Forum | Thu Dec 20 12:05:46 EST 2007 | realchunks
Not you Steven. Blanket comments like "Double pass printing for solder paste is not needed and will cause defects. Redesign your stencil thickness or aperture sizes, change your paste mesh size or type, go to 45 degree blades." are so way off base.
Electronics Forum | Fri Feb 09 20:05:15 EST 2001 | benefid
The ENIG process will yield between 3-7 micro inches (110 - 275 microns) of gold over the nickel barrier. This thickness range is pretty much the limit as this is a self limiting displacement reaction process. Once all surface nickel ions are repl
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Thu Sep 14 13:34:43 EDT 2000 | Boca
Of course the others have great answers, try NOT to do it, for all of their reasons. However, had to do it in the past, OEM, custom chip, die wouldn't fit in a SM package, volume wouldn't support a second package type ...... and on and on. So we us
Electronics Forum | Tue Jan 03 16:23:37 EST 2006 | Phil
Our past experience with Frost and Sullivan is that they derive most of their data from interviews with the subject companies and press releases. That puts them a half a notch above asking the sales reps for info (except with F&S, the total won't be
Electronics Forum | Fri Aug 27 00:26:14 EDT 2004 | charly
hi, encounter few cases PCB was delam after reflow, and the supplier was refuse that this is a PCB manufacturing defect as the fallout is low within one lot. the cost for this scrap is high after PCBA level, my query here are 1) is there any way
Electronics Forum | Fri Dec 10 02:26:16 EST 1999 | Tracy Guo
Hi, I'm facing smear after printing on DEK288 using reverse squeegee at the edge of panels. I've checked the fixture, printing parameter, stencil, solder paste. What else can I do?
Electronics Forum | Thu Jan 27 19:14:27 EST 2000 | Dennis
Thanks! It is right that solder paste is somewhat responsible for misssing components in our case. I took a look at the board after placement and I found that component hit the paste, but no where on the board. I guesss dry solder paste (operater pri
Electronics Forum | Wed Aug 15 13:40:55 EDT 2001 | rkevin
Just as there are a number of causes of solder balling there are also several factors which can lead to or encourage the formation of solder beads. - During the placement of the component solder paste may be squeezed out from underneath the compone
Electronics Forum | Mon Aug 24 08:34:14 EDT 1998 | JUSTIN MEDERNACH
| Hi, | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | We have rule out the possibility of not printing any solder paste
