Electronics Forum | Fri Aug 03 05:13:01 EDT 2001 | mugen
Well none of us, really know whether, this 0805 CAP is really an unsolder/tombstone defect, coz none of us verfied this with, our own eyes *duh* Funny, this only happened for us, on 0402 ~ 0201 SMD.... Check your land-pad design specifications, if
Electronics Forum | Sat Jun 13 00:33:41 EDT 1998 | Scott McKee
| Hidee Ho Brian! | Just like the other Steve, we just bought a SPM too. Our is brand new, and it's a SPM-AV (has vision). The other option we have is a automatic underside stencil cleaner. | We're a contract assembler as well, just starti
Electronics Forum | Fri Jan 19 04:12:37 EST 2007 | AR
Hi I know that pump stencil technology can be used to print adhesive on boards with TH components already placed and clinched, but what about solder paste? The production sequence goes like this: First the jumper wires are placed and clinched with
Electronics Forum | Mon Nov 17 11:09:56 EST 2003 | Frank
Hi, I have a soldering problem with a header SMT straight single row of 8 pins. It's a samtec #TSM-108-03-T-SV-P (P&P). The first problem I have is an allignement one. I do not use alignement pin for now but I expect to use it. Concerning solder
Electronics Forum | Mon Mar 03 15:44:56 EST 2014 | emeto
with 0.5mm pitch I wouldn't go too fast. Check your separation speed as well as your print area(may be you can drive your squeegees 1-2 inches less). Some pastes like Alpha like very fast separation. so you can win another 2-3 seconds from there.What
Electronics Forum | Wed Jun 18 09:13:44 EDT 2008 | realchunks
You're barking up the wrong tree. Solder "splashes" are generally caused by your print being off pad a bit. They are called solder fines. I've never seen a placement machine have the capability to push paste around using it's kiss-off from the noz
Electronics Forum | Tue Jul 20 17:47:28 EDT 1999 | Deon Nungaray
| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste
Electronics Forum | Fri Mar 12 13:30:06 EST 1999 | Bill Schreiber
Dear Scott, You are correct in questioning the chemistry portion of the process. However, I am couriuous as to why you selected DEK as a stencil cleaner. The most important part of any cleaning process is always the chemistry. How you deliver the c
Electronics Forum | Fri Mar 12 13:40:53 EST 1999 | Bill schreiber
In a nutshell, you should be looking for a chemistry first, then look for a machine. Hopefully, they will be from the same source. | Dear Scott, | You are correct in questioning the chemistry portion of the process. However, I am couriuous as to w
Electronics Forum | Mon Jul 07 00:45:39 EDT 2014 | comatose
If you study how the process is done now, it isn't that different from what you describe. Instead of glue, we use solder paste, and instead of spraying it we screen print it. But not that different. For feeding boards we use conveyors instead of rubb
