Electronics Forum: solder paste printing (Page 251 of 800)

Re: SDRSS

Electronics Forum | Thu Jul 20 15:08:53 EDT 2000 | Bob Willis

Yes no problem here it is in a nut shell. The sponsor of my CD ROM on this process was Loctite who specifically developed a glue for the process to cure in less than 10seconds. Have a word with these guys they may even have a few CDs. PROCESS SEQUEN

Re: Stencil Cleaning

Electronics Forum | Fri Mar 12 18:12:15 EST 1999 | B. Walton

Spray cleaners are poor alternatives to todays ultrasonic stencil cleaners. Ultrasonics are the way to go and you can use rather benign water based chemistries to get the job done. As for screening adhesives and cleaning glue residue with spray wands

Any help reflow soldering Through Hole parts

Electronics Forum | Fri Mar 06 10:43:32 EST 1998 | Alan Pestell

We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. 1) Do you need to

Re: Printing Adhesive

Electronics Forum | Fri May 07 18:01:11 EDT 1999 | Bill Schreiber

Just a note about cleaning SMD adhesives. Cleaning does not need to be hazardous. Smart Sonic has a non hazardous process that has been used for over 9 years using a non hazardous detergent that has been certified by the AQMD as a clean air chemist

Re: Printing Adhesive

Electronics Forum | Fri May 07 18:02:37 EDT 1999 | Bill Schreiber

Just a note about cleaning SMD adhesives. Cleaning does not need to be hazardous. Smart Sonic has a non hazardous process that has been used for over 9 years using a non hazardous detergent that has been certified by the AQMD as a clean air chemist

SMT

Electronics Forum | Wed Mar 05 05:29:49 EST 2003 | Matherat

Our company does not assemble boards but our customers do and 2 side smd with through hole is pretty common in our experiences.Our customers usually have already decided to glue the bottom side components and fuse them during the wave solder process.

Re: screen printer and stencil printer

Electronics Forum | Wed Aug 18 21:10:23 EDT 1999 | se

| | | Hi, | | | I'd like to ask some tips about the merits and shortcomings o | | | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | | | application? | | | The board

Gold Contacts

Electronics Forum | Wed Mar 21 16:32:03 EST 2001 | mparker

The root cause is dependant on the type of solder "splash", ball, whatever, that you are seeing post reflow. If it is smears, then cleaning the stencil underside is probably the answer. Are you using automatic wipers? How many print cycles between w

Solder Ball After Reflow Process

Electronics Forum | Wed Aug 16 13:52:24 EDT 2006 | russ

Oven settings are meaningless here. What does the board see? It is the paste we are concerned about not what the heaters are running at hehe. These solder balls are at the end of pad, which end? under the part or away from the part. I believe you

where to get good flux

Electronics Forum | Wed Apr 03 19:03:31 EDT 2013 | hegemon

In agreement, in that you should have already printed enough paste on the board to accomodate the joint. Adding paste would give the result you described. (too much solder) Adding a little flux (only) and heat would be the correct path out of that s


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