Electronics Forum | Sat Dec 05 09:17:24 EST 2009 | nagesh
Solder paste & reflow the Bottom side.Use wave solder pallet to isolate the soldered components.
Electronics Forum | Mon Oct 09 05:57:33 EDT 2017 | jamesbarnhart
Reflow profiling/soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical components to their contact pads, after which the entire assembly is subjected to c
Electronics Forum | Thu Mar 19 15:01:00 EDT 2020 | emeto
Overprinting until the solder paste start detaching from the joint and start forming solder balls. Based on finish, chemistry and type solder mask this number will be different.I also wouldn't call it "better solderability".
Electronics Forum | Mon Sep 27 09:24:33 EDT 2021 | dianau
Hello all, Does anyone here knows if it exist a special solder paste for diode laser soldering? What are the property that should have? Currently we are using a lead free solder with 2.5% flux. Thank you!
Electronics Forum | Thu Jan 20 13:56:51 EST 2022 | stivais
For me it seems that the board is already assembled & soldered. Before assembling the board had been (poorly) washed (misprint perhaps) and the spots are just melted solder paste. Aren't those solder balls in the grooves between the pads and solder
Electronics Forum | Tue May 08 11:23:11 EDT 2001 | rwilliams
I have been tasked with determining the Life of a Solder Stencil and how to track it. (Basically, how do we know when to replace the stencil, E.g., deterioration of print quality, physical damage, etc.) Obviously there are a lot of variables, but is
Electronics Forum | Mon Aug 24 18:45:11 EDT 1998 | Steve Evers
| We are looking at implimenting a bar code system for a SMT | production line. To start we are looking at label printer/applicators. Are there any other companies that we should consider besides Zebra and Imtec?? Thanks for your input. | John If
Electronics Forum | Thu Oct 01 11:40:17 EDT 1998 | Justin Medernach
Are there anyone who can give me the answer about solder ball problem? | We have 12 layer PCB and double sided PCB. After one side reflow soldering We found lots of solder ball under the PCB. The solder ball was coming out from via hole. | So
Electronics Forum | Tue Sep 18 12:05:08 EDT 2001 | jschake
Optimal Print Parameters: I have responded to a similar question in the thread titled �Stencil Printing For 0201 Applications�, posted by markt and will refer you to that for addressing this question. If you seek clarification on any of those point
Electronics Forum | Fri Aug 03 15:58:07 EDT 2001 | arsmoriendi
Hi again! First thanks to all for your help. Second, i beleive that i need to clarify something, the unsoldered component was caused due a missing window in the stencil, the process engineer leave the stencil in the production line after i
