Electronics Forum | Wed Oct 17 04:52:17 EDT 2001 | Matt Kehoe
Dave, I know this is very dated but do you still need info in smd boards with the paste already on them??? I can help if you do. Let me know Matt Kehoe
Electronics Forum | Fri Jul 23 04:16:21 EDT 1999 | Charles Stringer
| Hi | | Does anyone have the details for whoever is the distributor of KOKI Pastes in the UK ? | | Thanks | | KW | Yes it is Electrolube (HK Wentworth Ltd.) ELECTROLUBE LIMITED BLAKES ROAD WARGRAVE READIN
Electronics Forum | Wed Oct 28 17:05:24 EST 1998 | Dave F
| Has anyone found a way to control viscosity of no-clean paste? | Mike: Mix it well and use the stuff before viscosity becomes an issue. Dave F
Electronics Forum | Wed Aug 22 17:29:29 EDT 2001 | Michael
We've found beading is not neccesarily the amount of paste but where it's applied. Trapping paste under components seems to be the culprit. On components where we couldn't reduce aperature size we simply moved it outward actually overprinting the p
Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai
Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,
Electronics Forum | Fri Oct 26 07:55:49 EDT 2001 | Kenny
Does anybody know how I work out how heavy a part I can have on the bottom side of the board while reflowing top. Obviously there is a tie between the footprint in the paste and the surface tension of solder paste, but what is it ?
Electronics Forum | Sat Jan 05 02:03:19 EST 2002 | hany_khoga
Dear all: For PBGA replacement by a hot air BGA rework station, do I have to follow the same temperature profile as the first original one in the reflow oven? Note that in the rework process I use only Flux paste (no solder paste is used). Hany
Electronics Forum | Wed Jun 26 09:17:55 EDT 2002 | davef
We've talked about it a fair amount here on SMTnet. Search the fine SMTnet Archives for background. People use a variety on names to talk about this. Common names are: * Paste in hole [PIH] * Pin & paste
Electronics Forum | Fri Sep 13 14:26:44 EDT 2002 | davef
We do not reuse paste that is on the stencil at the end of a shift. Search the fine SMTnet Archives for previous descussions on this topic.
Electronics Forum | Wed Sep 18 20:55:33 EDT 2002 | scottefiske
I'm with you dave...please provide specifics as to defect condition... Are you getting good wetting to both land and lead? Is there any repeatability to lead/location/device? Do you have paste inspection capabilites to verify deposition? Is it a Pala
