Electronics Forum | Sat Apr 11 14:31:16 EDT 1998 | Gary Simbulan
| | I would like to invite everyone to share/discuss | | information/knowledge/experience they have with | | the req's that are assumed to be valid for the | | temperature/time relation in the process of reflow | | soldering Pin In Paste, Intrusive R
Electronics Forum | Mon Apr 22 20:55:00 EDT 2002 | ianchan
Hi, this is not really a technical solution, just a feedback. we too have a model series using the same WS paste type. it gives a dull solder joint with white residue that can be marginally removed after post-DI water rinse (ie. not 100% removed).
Electronics Forum | Tue Mar 24 11:20:18 EST 1998 | Earl Moon
| Anyone have an idea how small a via must be to inhibit significant solder volume escaping into the via? Typically, micro vias are drilled and plated to about .003" diameter. To avoid significant solder "drain off," they should be drilled as shallow
Electronics Forum | Wed Feb 26 04:28:39 EST 2014 | chongns
Hi All member I have a problem on the stable down the color of the white solder mask PCB. first, i tough the color differences was cause by the solder mask ink, but after a close look, the color change are cause by the copper under the solder mask
Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire
Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a
Electronics Forum | Wed Nov 08 20:45:32 EST 2000 | Dave Rygwalski
We are using Austin American Technologies with Petroferm solutions and have excellent results using the same two types of solvents for cleaning stencils, adhesives and miss print boards. I average about five hundred cleaning cycles before we have the
Electronics Forum | Sat Oct 28 08:41:37 EDT 2000 | Aaron
1. Check printing accuracy. 2. Check placement accuracy. 3. Your components should be kept in a good environment to prevent oxidation of terminations. 4. Pads pattern should be designed according to standards. If 1.2. are okay, you should suspect 3
Electronics Forum | Thu Sep 21 20:22:14 EDT 2000 | Dave F
Mike: Why not hold this conversation on-line, so that we can all benefit? That's really one of the purposes of forums like SMTnet ... free flow of information for the benefit of all. Not a place where sale-types can develop contacts. Right??? Wh
Electronics Forum | Fri Sep 22 08:04:34 EDT 2000 | K.T
I 100% agree with Wolfgang. No matter how many in line or off line inspection gadgets, zillion $ printers, and top of line stencils you use, bottom line is a properly trained machine operator who gives a rat about his/her job that makes the differenc
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