Electronics Forum | Tue May 02 14:38:06 EDT 2006 | bhall
Currently I am using a water soluble solder paste and no clean wire solder. For awhile now I have been pushing to switch to no clean across the board. Can anyone give me an idea of how this will effect production? Switching to no clean will allow m
Electronics Forum | Sat Jun 10 07:27:24 EDT 2006 | davef
Chuckie: SM4007A Diode case is D0-214AC G. Eisner: On tombstoning: * Check reflow profile * Pads per IPC-SM-782 * Reduce amount of solder paste * Check component solderability * Place component accurately * Search the fine SMTnet Archives for backgr
Electronics Forum | Wed Aug 09 12:22:11 EDT 2006 | Rob
You are going to struggle with that sort of connector - the only pin headers that seem to have widespread sucess are the dual inline ones with bent over j leads that sit on the board. They come with a plastic hat that allows vacuum pick up. However
Electronics Forum | Thu Sep 07 10:32:12 EDT 2006 | slthomas
Is the solder reflowing on the pad but not wicking up the lead, or does there appear to be insufficient solder to wet both, or is it not reflowing at all, or.....? Have you verified your profile? What is the condition of your paste (expiration date,
Electronics Forum | Wed Oct 04 11:36:06 EDT 2006 | flipit
Hi, Anyone ever have an issue with stray capacitance when using no clean solder paste. We are having a timing problem on one product. The problem goes away when we clean the assemblies. We use a no clean process normally. These assemblies worked
Electronics Forum | Mon Oct 09 10:58:26 EDT 2006 | Matt Smith
Over the past several months we have experienced intermittent problems with wave solder voids on PCBs coated with OSP. We suspect variation in the OSP application process, or oxidation of the surface due to insufficient or degraded OSP. Is there a me
Electronics Forum | Wed Feb 14 10:10:55 EST 2007 | rob_thomas
The challenge regarding the stencil was mostly due to the actual board layout and nothing having to do with the voids in the solder. It was my first encounter with 0.5 mm pitch on BGA and dealing with a LF solder paste with higher viscosity than tha
Electronics Forum | Tue Jul 31 08:05:12 EDT 2007 | aj
Hi all, I was just wondering if everyone has experienced a significant rise in cost of solder bar & paste over the last 6 months or so. I use Alpha SACX and we have seen roughly 50% increase in cost . Just wondering what others are paying per kg?
Electronics Forum | Mon Sep 24 12:47:37 EDT 2007 | PJ
I am doing some research on flux free/flux less SMT reflow soldering. Do you have any equipent/process recommendations? Does anybody use it for volume production and what are the constraints (finish, balls, paste, vacuum, pressure, size)? What is
Electronics Forum | Fri Jul 11 15:47:54 EDT 2008 | hegemon
We used these same type of parameters regardless of the QFN package size. We used componentes that ranged from 3x3mm to 12x12mm Same idea. The reduction in solder paste for the center pad is the key. Too much, and you wind up with no connects at the
